Zobrazeno 1 - 10
of 42
pro vyhledávání: '"Michel Mermet-Guyennet"'
Autor:
Piotr Dworakowski, Andrzej Wilk, Michal Michna, Bruno Lefebvre, Fabien Sixdenier, Michel Mermet-Guyennet
Publikováno v:
Energies, Vol 13, Iss 6, p 1352 (2020)
The magnetizing inductance of the medium frequency transformer (MFT) impacts the performance of the isolated dc-dc power converters. The ferrite material is considered for high power transformers but it requires an assembly of type “I” cores resu
Externí odkaz:
https://doaj.org/article/04fdb2240bce45a8872de5b3bfa61797
Publikováno v:
IEEE Transactions on Power Delivery. 37:116-124
This article presents the modified Preisach model of hysteresis for a 3-phase medium frequency transformer in a 100 kW dual active bridge converter. The transformer magnetic core is assembled out of ferrite I-cores, which results in multiple parasiti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::749ed145fcb6f511bf97f74bd8568005
https://doi.org/10.1109/tpwrd.2021.3054059
https://doi.org/10.1109/tpwrd.2021.3054059
Autor:
Luong Viet Phung, Michel Mermet-Guyennet, Hervé Morel, Pascal Bevilacqua, Besar Asllani, Dominique Planson, Thomas Lagier, Beverley Choucoutou
Publikováno v:
Materials Science Forum. 1004:923-932
This paper reports the device design, fabrication and characterisation of 10 kV-class Bipolar Junction Transistor (BJT). Manufactured devices have been packaged in single BJT, two paralleled BJTs and Darlington configurations. The static and switchin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8dafdd84b724977464172aea74f9c8d0
https://doi.org/10.4028/www.scientific.net/msf.1004.923
https://doi.org/10.4028/www.scientific.net/msf.1004.923
Autor:
Andrzej Wilk, Piotr Dworakowski, Michel Mermet-Guyennet, Fabien Sixdenier, Michał Michna, Bruno Lefebvre
Publikováno v:
Energies
Energies, MDPI, 2020, 13 (6), pp.1352. ⟨10.3390/en13061352⟩
Energies, Vol 13, Iss 6, p 1352 (2020)
Volume 13
Issue 6
Energies, MDPI, 2020, 13 (6), pp.1352. ⟨10.3390/en13061352⟩
Energies, Vol 13, Iss 6, p 1352 (2020)
Volume 13
Issue 6
The magnetizing inductance of the medium frequency transformer (MFT) impacts the performance of the isolated dc-dc power converters. The ferrite material is considered for high power transformers but it requires an assembly of type &ldquo
I&rdqu
I&rdqu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::261b2558c8454f3b18360c74cd9122ce
https://hal.archives-ouvertes.fr/hal-02508897
https://hal.archives-ouvertes.fr/hal-02508897
Publikováno v:
IFAC Proceedings Volumes. 43:80-85
The major failure mode of power IGBT is the thermal fatigue of the solder joints. The thermal heating induces mechanical constraints due to the various coefficients of thermal expansion of different materials. The life in fatigue, bound to the non-el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abdce9bf7cf2cd2e7fc8f7b5e2104ba4
https://doi.org/10.3182/20100701-2-pt-4012.00015
https://doi.org/10.3182/20100701-2-pt-4012.00015
Publikováno v:
Microelectronics Reliability. 49:631-641
The weak point for Insulated-Gate Bipolar Transistor (IGBT) modules in terms of reliability is thermal fatigue in solder joints due to the thermal stress induced by constitutive materials with different coefficients of thermal expansion (CTE). Now, m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0b65cb5bc231e4857390ed3a25079e4
https://doi.org/10.1016/j.microrel.2009.02.025
https://doi.org/10.1016/j.microrel.2009.02.025
Autor:
Bertrand Chauchat, Michel Mermet-Guyennet, J. L. Fock-Sui-Too, Patrick Tounsi, Patrick Austin, Régis Meuret
Publikováno v:
Microelectronics Reliability. 48:1453-1458
As for railway traction applications, aeronautical power electronics implies high power density handling. Moreover typical aeronautical applications impose a harsh thermal environment. SiC technology has recently emerged for high power and high tempe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7965449d12f0e12a0ccf11680b8ed7f
https://doi.org/10.1016/j.microrel.2008.07.051
https://doi.org/10.1016/j.microrel.2008.07.051
Autor:
X. Jorda, Michel Mermet-Guyennet, Jose Rebollo, Jean-François Serviere, J. Urresti-Ibanez, Xavier Perpiñà, A. Fauquet, Salvador Hidalgo
Publikováno v:
Digital.CSIC. Repositorio Institucional del CSIC
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5 páginas, 8 figuras.
This work reports two different characteristic patterns detected in IGBT chips failed in real operation (railway application) by failure analysis procedures. The analysed chips have been recovered from the rheostatic chopp
This work reports two different characteristic patterns detected in IGBT chips failed in real operation (railway application) by failure analysis procedures. The analysed chips have been recovered from the rheostatic chopp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::147ee0c348b6575b1453a81d9bfcb6a7
https://doi.org/10.1016/j.microrel.2008.06.032
https://doi.org/10.1016/j.microrel.2008.06.032
Publikováno v:
International Journal for Simulation and Multidisciplinary Design Optimization, Vol 2, Iss 2, Pp 149-156 (2008)
The weak point for the standard power IGBT modules in terms of reliability is thermal fatigue in solder joints due to the thermal stress induced by constitutive materials with different coefficients of thermal expansion (CTE). So far, many researches
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::84bdb7869132030fb32e184558b081d8
https://doi.org/10.1051/smdo:2008020
https://doi.org/10.1051/smdo:2008020
Autor:
Jean-Pierre Fradin, Michel Mermet-Guyennet, X. Chauffleur, Jose Saiz, Alberto Castellazzi, Mauro Ciappa, P. Solomalala
Publikováno v:
Microelectronics Reliability. 47:1343-1348
To develop reliable integrated power electronics, it is paramount to consider the coupling between electrical, thermal and mechanical effects. Though essential for final validation, experimental analysis is time-consuming, especially when trying out
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::207bdf9cd5fa05ae547e993f8a61e230
https://doi.org/10.1016/j.microrel.2007.07.006
https://doi.org/10.1016/j.microrel.2007.07.006