Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Michel Fakes"'
Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components
Publikováno v:
International Journal of Heat and Mass Transfer. 51:6006-6017
The transient performance of a flat heat pipe (FHP) used to cool multiple electronics components, is presented in this paper. The fluid flows in both wick and vapor core were computed using a transient 2D hydrodynamic model (T2DHM). This model was co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8b142a1d235f779d73ac84f75148f32
https://doi.org/10.1016/j.ijheatmasstransfer.2008.04.071
https://doi.org/10.1016/j.ijheatmasstransfer.2008.04.071
Autor:
Franck Perot, Vincent Le Goff, Min-Suk Kim, Michel Fakes, Philippe Chiozzi, Vincent Vidal, Erwan Le Goff
Publikováno v:
Volume 1A: Aircraft Engine; Fans and Blowers.
The increasing demand for comfort and quietness from the automotive industry transforms the acoustics performances of subsystems as a critical input for the selection of a specific design. Among this market, rotating systems noise takes a growing imp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ee39d6819e87318d0f08fa46af7ce88
https://doi.org/10.1115/gt2014-26386
https://doi.org/10.1115/gt2014-26386
Publikováno v:
Applied Thermal Engineering
Applied Thermal Engineering, Elsevier, 2011, ⟨10.1016/j.applthermaleng.2011.02.034⟩
Applied Thermal Engineering, Elsevier, 2011, ⟨10.1016/j.applthermaleng.2011.02.034⟩
International audience; This paper presents a theoretical investigation of a Flat Heat Pipe (spreader) designed for the cooling of multiple electronic components in transient state. This model is a transient model, coupling 3D thermal model with a 2D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6c4f4da9394e0eca131450d13f65840d
https://hal.archives-ouvertes.fr/hal-00743915
https://hal.archives-ouvertes.fr/hal-00743915
Autor:
Sabrine Mrad, Philippe Masson, Gael Blondel, Philippe Dessante, Philippe Chiozzi, Michel Fakes, Pierre Lefranc
Publikováno v:
Proceedings of IECON'09 Annual Conference
IECON'09 Annual Conference of the IEEE Inductrial Electronics Society
IECON'09 Annual Conference of the IEEE Inductrial Electronics Society, Nov 2009, Porto, Portugal. pp.CD-Rom Proceedings
IECON'09 Annual Conference of the IEEE Inductrial Electronics Society
IECON'09 Annual Conference of the IEEE Inductrial Electronics Society, Nov 2009, Porto, Portugal. pp.CD-Rom Proceedings
The paper is about a so-called ”diffusive representation”, a new modeling dynamic systems method and its application to efficient transient thermal modeling of multichip power module taking into account thermal coupling effects. Compact thermal m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::15955c6085d59f17c9c3897b453a0bcc
https://hal-supelec.archives-ouvertes.fr/hal-00438640
https://hal-supelec.archives-ouvertes.fr/hal-00438640
Publikováno v:
International Symposium on Advances in Computational Heat Transfer.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8da3019c3d1a7a244e86c27f3b2eea3
https://doi.org/10.1615/ichmt.2008.cht.1450
https://doi.org/10.1615/ichmt.2008.cht.1450
Publikováno v:
Heat Transfer: Volume 2.
This work is aimed to simulate the transient performances of a flat heat pipe (FHP) used to cool electronics components in automotive applications. A transient 3D thermal model (T3DTM) of the FHP wall is performed to calculate the heat transfer throu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ff533ac1f663035a854197b0813345d
https://doi.org/10.1115/ht2008-56105
https://doi.org/10.1115/ht2008-56105