Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Michael William Phaneuf"'
Autor:
Haripriya E. Prakasam, Richard H. Livengood, Ken Guillaume Lagarec, Michael William Phaneuf, Christopher M. Scheffler
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper provides information on ion beam dose delivery and machining a perfect pattern in an ideal world and summarizes the various beam control limitations of the current generation systems. It discusses conventional and proposed solutions to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f22d1c637de175d59b635ba4965cf9a
https://doi.org/10.31399/asm.cp.istfa2016p0382
https://doi.org/10.31399/asm.cp.istfa2016p0382
Publikováno v:
International Symposium for Testing and Failure Analysis.
Competitive circuit analysis of Integrated Circuits (ICs) is one of the most challenging types of analysis. It involves multiple complex IC die de-processing/de-layering steps while keeping precise planarity from metal layer to metal layer. Each step
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::773e4e2813b1108ebf38ef4ecfca5de7
https://doi.org/10.31399/asm.cp.istfa2015p0092
https://doi.org/10.31399/asm.cp.istfa2015p0092
Autor:
Michael William Phaneuf, Jian Li, Kathryn Noll, Peter Carleson, J. David Casey, Clive D. Chandler, Thomas J. Gannon, Alex Krechmer, Nicholas Antoniou, David Monforte, Richard F. Schuman, Michael Megorden, Neil J. Bassom, Chuong Huynh
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 20:2682
Focused ion beam (FIB) methodologies for successfully milling copper (U.S. Patent No. 6,322,672 B1) have been demonstrated. Approaches to milling copper (Cu) are required because standard FIB mill procedures produce rough, uneven cuts that are unsuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::417085e5def94515054870afaa02a806
https://doi.org/10.1116/1.1521736
https://doi.org/10.1116/1.1521736