Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Michael T. Andreas"'
Autor:
Philippe Roussel, Masayuki Wada, Peter Leunissen, Karine Kenis, Paul Mertens, Michael T. Andreas, Kurt Wostyn, Twan Bearda
Publikováno v:
ECS Transactions. 25:211-217
Particle removal without damage addition remains a grand challenge. Particle removal and damage addition are macroscopic effects of the cleaning technique. In order to improve the understanding of cleaning techniques like high-velocity-aerosol cleani
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9562347e7a77bcd8f8c2b8b477b1899b
https://doi.org/10.1149/1.3202655
https://doi.org/10.1149/1.3202655
Autor:
K. Kenis, Paul Mertens, Michael T. Andreas, Peter Leunissen, Francesca Barbagini, Toan-Le Quoc, Kurt Wostyn, Twan Bearda, Kyung-hyun Kim, Sandip Halder, Tom Janssens
Publikováno v:
Journal of Adhesion Science and Technology. 23:1709-1721
The increasing complexity of semiconductor devices imposes challenging requirements on particle contamination and surface damage. To meet these requirements novel surface-cleaning processes are evaluated, which combine physical energy with organic so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2dd13c1bf8b153cb6e1c732ebb18c956
https://doi.org/10.1163/016942409x12459095670430
https://doi.org/10.1163/016942409x12459095670430
Autor:
Twan Bearda, Kurt Wostyn, Karine Kenis, Tom Janssens, Masayuki Wada, Paul Mertens, Michael T. Andreas
Publikováno v:
Solid State Phenomena. :39-42
High velocity aerosol cleaning using ultrapure water or dilute aqueous solutions (e.g. dilute ammonia) is common in semiconductor IC fabrication [1]. This process combines droplet impact forces with continuous liquid flow for improved cleaning effici
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bced53ef4753ab0e56b1cd5d2a8fc1d7
https://doi.org/10.4028/www.scientific.net/ssp.145-146.39
https://doi.org/10.4028/www.scientific.net/ssp.145-146.39
Autor:
Angus I. Kingon, Michael T. Andreas
Publikováno v:
Chemistry of Materials. 3:428-431
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63579d5ced05cf2d5ba3e74075096f76
https://doi.org/10.1021/cm00015a014
https://doi.org/10.1021/cm00015a014
Autor:
Sandip Halder, Karine Kenis, Twan Bearda, Michael T. Andreas, Antoine Pacco, Steven Brems, Paul Mertens, Rita Vos, Masayuki Wada, Kurt Wostyn
Publikováno v:
ECS Meeting Abstracts. :2081-2081
As device structures become smaller they also become more fragile. With the incorporation of metal-high-k layers and shallower implants galvanic corrosion and substrate loss requirements are becoming an important issue. Aqueous chemistries are ceasin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7c5c9c7152e6f7164d455dc3ac7c53e3
https://doi.org/10.1149/ma2009-02/24/2081
https://doi.org/10.1149/ma2009-02/24/2081