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pro vyhledávání: '"Michael S. Cranmer"'
Autor:
Benjamin V. Fasano, Richard F. Indyk, Brittany Hedrick, Franklin M. Baez, Jorge Lubguban, Michael S. Cranmer, Shidong Li, Luc Guerin, Sarah H. Knickerbocker, David J. Lewison, Marc Phaneuf Luc Ouellet, Ian D. Melville, Koushik Ramachandran, Charles L. Arvin, Maryse Cournoyer, Daniel Berger, Christopher L. Tessler, John J. Garant, Matthew Angyal, Jean Audet, Vijay Sukumaran, Subramanian S. Iyer
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The processes key to enabling 3D manufacturing, namely, bond, backgrind, and through silicon via (TSV) reveal, are extended for 300 mm glass substrates to fabricate a heterogeneous, multi-die, 2.5D glass interposer. Based on an existing silicon inter