Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Michael Libois"'
Publikováno v:
IEEE Transactions on Antennas and Propagation. 69:1414-1426
This article presents the design of integrated antennas in the $D$ -band (110–170 GHz). First, an electromagnetic analysis is used to tune the propagation characteristics of surface waves supported on an artificial magnetic conductor (AMC). Next, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bce24d1fbf4f4e2e7b7d489cee7212f8
https://doi.org/10.1109/tap.2020.3031411
https://doi.org/10.1109/tap.2020.3031411
Autor:
Chunshu Li, Bob Verbruggen, John R. Long, Giovanni Mangraviti, Charlotte Soens, Wim Van Thillo, Andre Bourdoux, Viki Szortyka, Michael Libois, V. Vidojkovic, Piet Wambacq, Mark Ingels, Kristof Vaesen, Khaled Khalaf
Publikováno v:
IEEE Journal of Solid-State Circuits. 51:1579-1592
A polar transmitter (TX) is implemented at 60 GHz, enabling a power amplifier (PA) to operate in saturation where efficiency is highest, even when handling higher order modulations such as QPSK and 16-QAM. The phase path is upconverted by I-Q mixers,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f94283fbf6e7a35aa737e6e0728ec8c
https://doi.org/10.1109/jssc.2016.2544784
https://doi.org/10.1109/jssc.2016.2544784
Autor:
Giovanni Mangraviti, Charlotte Soens, Piet Wambacq, Khaled Khalaf, Michael Libois, Wim Van Thillo, Kristof Vaesen, Steven Brebels
An eight-way phased-array TRX front-end with RF phase shifting and on-chip transmit/receive switching is implemented in 28-nm CMOS. The TX $P_{\mathbf {1dBout}}$ and RX noise figure (NF) are 10 dBm and 6.8 dB, respectively. The active phase shifter s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fcd50990880188fb69b3531414047767
https://doi.org/10.1109/jssc.2018.2822676
https://doi.org/10.1109/jssc.2018.2822676
Autor:
Giovanni Mangraviti, Kristof Vaesen, Steven Brebels, Piet Wambacq, Michael Libois, Charlotte Soens, Khaled Khalaf
Publikováno v:
ESSCIRC
An 8-way phased array TRX front-end with RF phase shifting and on-chip TR switching is implemented in 28nm CMOS . The TX OP1dB and RX NF are 10dBm and 6.8dB, respectively. The active phase shifter shows less than 5° phase resolution and amplitude er
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8785686b82e44fe1c5a364f4b62fc2b4
https://doi.org/10.1109/esscirc.2017.8094561
https://doi.org/10.1109/esscirc.2017.8094561
Autor:
Paul Heremans, Adrian Chasin, Jan Genoe, Maarten Rockele, Michael Libois, Vladimir Volskiy, Kris Myny, Manoj Nag, Guy A. E. Vandenbosch, Georges Gielen
Publikováno v:
IEEE Transactions on Electron Devices. 61:3289-3295
We present an ultrahigh frequency energy harvester based on low temperature processed a-IGZO (amorphous indium-gallium-zinc oxide) semiconductor on a glass substrate. The harvester is composed of a dipole antenna, matching network, and a double half-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43cde69e485219e48be3822c71b1df62
https://doi.org/10.1109/ted.2014.2340462
https://doi.org/10.1109/ted.2014.2340462
Autor:
Eric Beyne, Wenqi Zhang, Gerald Beyer, Antonio La Manna, Geert Van der Plas, Yuuki Araga, Michael Libois, Paul Marchal, Makoto Nagata
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1026-1037
Silicon substrates can be strategically isolated or unified among tiers in a through-silicon-via (TSV)-based 3-D integrated circuit (IC) structure, for the suppression of intertier substrate noise coupling or the reduction of grounding impedance of s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3777cf2d891f84523ee4d6cdbce910c
https://doi.org/10.1109/tcpmt.2014.2316150
https://doi.org/10.1109/tcpmt.2014.2316150
Autor:
G. Van der Plas, Michael Libois, Gerd Vandersteen, L. De Locht, Stephane Bronckers, Y. Rolain
Publikováno v:
Vrije Universiteit Brussel
The coupling of the transmitted radio-frequency (RF) signal of the power amplifier (PA) in the sensitive voltage-controlled oscillator (VCO) remains a major problem for system-on-chip (SoC) design. Coupling between these two circuits may cause malfun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a940a083b9d44b6193ee57aa111cbb53
https://doi.org/10.1109/tim.2009.2015705
https://doi.org/10.1109/tim.2009.2015705
Autor:
Kris Myny, Manoj Nag, Jan Genoe, Marc Ameys, Adrian Chasin, Michael Libois, Maarten Rockele, Soeren Steudel, Sarah Schols, Guy A. E. Vandenbosch, Vladimir Volskiy, Paul Heremans, Walter De Raedt, Georges Gielen
Publikováno v:
2013 IEEE International Electron Devices Meeting.
We present an energy harvester composed of a dipole antenna, matching network and a rectifier based on thin-film metal-oxide (amorphous Indium-Gallium-Zinc Oxide, IGZO) semiconductor Schottky diodes, operating at 868MHz. S-parameters measurements sho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::435648b94ba7c280207b36b88a2afbac
https://doi.org/10.1109/iedm.2013.6724608
https://doi.org/10.1109/iedm.2013.6724608
Autor:
Steven Brebels, Kuba Raczkowski, Giovanni Mangraviti, Annachiara Spagnolo, Charlotte Soens, V. Vidojkovic, Andre Bourdoux, Viki Szortyka, Kristof Vaesen, Piet Wambacq, Vito Giannini, Bertrand Parvais, Min Li, Michael Libois, Praveen Raghavan, Khaled Khalaf, John R. Long
Publikováno v:
CICC
The availability of 9GHz bandwidth around 60GHz in combination with simple modulations schemes, low-cost radio ICs and small antenna size, allows for multi Gbit/s wireless communications. In this article the potential of 60GHz wireless communications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e830bb222a2b810d8950b070b4ca3ca4
Autor:
Antonio La Manna, Geert Van der Plas, Jae-Min Kim, Michael Libois, Wenqi Zhang, Yuuki Araga, Pol Marchal, Eric Beyne, Makoto Nagata, Youssef Travaly, N. Minas
Publikováno v:
3DIC
Power and substrate domains are strategically isolated or unified in heterogeneous 3D integration. In-tier probing circuitry provides accessibility to power delivery and substrate networks in a deep tier of a 3D chip stack and capability of diagnosin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c46e301cf01069f795ba9863487d865c
https://doi.org/10.1109/3dic.2012.6262964
https://doi.org/10.1109/3dic.2012.6262964