Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Michael Joo Zhong Lim"'
Autor:
Liangxing Hu, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Xin Ju, Chuan Seng Tan
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6abfa90132517dd692723ab7c66b742c
https://doi.org/10.23919/icep58572.2023.10129764
https://doi.org/10.23919/icep58572.2023.10129764
Autor:
Liangxing Hu, Shuyu Bao, Yue Wang, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Sai Choo Tan, Kai Hwa Chew, Chuan Seng Tan
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::979b27fc28570002243f3f2ae7f7266b
https://doi.org/10.1109/eptc56328.2022.10013260
https://doi.org/10.1109/eptc56328.2022.10013260
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6544d20b0cde786e41c9916df32d9ccc
https://doi.org/10.1109/ectc51906.2022.00060
https://doi.org/10.1109/ectc51906.2022.00060
Publikováno v:
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef7354b897781e69bdeacb2c16df8b50
https://doi.org/10.1109/edtm53872.2022.9798354
https://doi.org/10.1109/edtm53872.2022.9798354
Autor:
Liangxing Hu, Jing Tao, Shuyu Bao, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Sai Choo Tan, Kai Hwa Chew, Chuan Seng Tan
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed469d3207521be1c374492e7bf3bd71
https://doi.org/10.1109/eptc53413.2021.9663936
https://doi.org/10.1109/eptc53413.2021.9663936
Autor:
Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan
Publikováno v:
2021 IEEE International 3D Systems Integration Conference (3DIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c55a0f41f901a57523ddb8f065c417b
https://doi.org/10.1109/3dic52383.2021.9687609
https://doi.org/10.1109/3dic52383.2021.9687609
Autor:
Simon Chun Kiat Goh, Jing Tao, Yu Dian Lim, Chuan Seng Tan, Liangxing Hu, Peng Zhao, Michael Joo Zhong Lim
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this article, we report in-depth parametric study of argon/nitrogen plasma-activated copper surfaces for copper-copper die-to-die direct bonding carried out at room temperature in cleanroom ambient condition. Surface analyses (e.g. water contact a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b5c3caa4290f51ef104dffca313b21d
https://doi.org/10.1109/ectc32696.2021.00077
https://doi.org/10.1109/ectc32696.2021.00077
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In reliability testing, integrated circuit (IC) packages are subjected to accelerated stress test according to the Joint Electron Device Engineering Council (JEDEC) standards to predict the lifetime under the operating conditions. Accelerated stress
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e32fe5df6acc6585de7dd646513a1a6c
https://doi.org/10.1109/eptc50525.2020.9315088
https://doi.org/10.1109/eptc50525.2020.9315088
Autor:
Jing Tao, Uvarajan M Velayutham, Yu Dian Lim, Chuan Seng Tan, Teddy Salim, Simon Chun Kiat Goh, Peng Zhao, Liangxing Hu, Michael Joo Zhong Lim
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:124001
In this paper, a two-step copper-copper direct bonding process in a non-vacuum environment is reported. Time-dependent evolution of argon/nitrogen plasma-activated copper surface is carefully studied. A multitude of surface characterizations are perf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fa0436a12850717ca347b5667417449
https://doi.org/10.1149/2162-8777/ac3b8e
https://doi.org/10.1149/2162-8777/ac3b8e
Autor:
Liangxing Hu, Simon Chun Kiat Goh, Jing Tao, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Salim, Teddy, M Velayutham, Uvarajan, Chuan Seng Tan
Publikováno v:
ECS Journal of Solid State Science & Technology; Dec2021, Vol. 10 Issue 12, p1-7, 7p