Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Michael J. Rightley"'
Publikováno v:
International Journal of Heat and Mass Transfer. 51:5182-5191
Heat transfer and laminar fluid flow in an array of parallel microchannels etched on a silicon substrate with water as the circulating fluid was studied numerically. The fluid region consisted of a microchannel with a hydraulic diameter of 85.6 μm a
Publikováno v:
Microelectronics Journal. 34:187-194
We present a novel micro-heat pipe wick design and fabrication technique to significantly boost the effective thermal conductivity of the heat pipe relative to the monolithic substrate material. Extensive porous flow modeling of the process has provi
Publikováno v:
Volume 5: Electronics and Photonics.
This paper analyzes the thermal design of an RF High Power amplifier. The device, with a maximum dimension of only .4 mm, has a high power density, dissipating up to 4 W. There is concern about the impacts of device proximity on thermal performance d
Autor:
Gregory Jay Elbring, Sunil G. Thomas, Mary F. Wheeler, Bob Gilbert, Jim Jennings, Seethambal S. Mani, John C. Lorenz, Larry W. Lake, Adolfo Rodriguez, Blake Elaine Jakaboski, Randy Allen Normann, Emilio Nunez, Rafael E. Banchs, Hector Klie, Chester J. Weiss, Michael J. Rightley, Bart G. van Bloemen Waanders, Scott P. Cooper, Chris Jablonowski
The project objective was to detail better ways to assess and exploit intelligent oil and gas field information through improved modeling, sensor technology, and process control to increase ultimate recovery of domestic hydrocarbons. To meet this obj
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98cb46daa1c29bbb383c02794bbb3043
https://doi.org/10.2172/966614
https://doi.org/10.2172/966614
Autor:
John Allen Emerson, Chung-Nin Channy Wong, Michael J. Rightley, Dale L. Huber, Blake Elaine Jakaboski
As electronic assemblies become more compact and increase in processing bandwidth, escalating thermal energy has become more difficult to manage. The major limitation has been nonmetallic joining using poor thermal interface materials (TIM). The inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14e7de2cd9490914ec788113c8af499d
https://doi.org/10.2172/902216
https://doi.org/10.2172/902216
Publikováno v:
Heat Transfer, Volume 2.
A new type of microchannel heat sink has been developed and evaluated in this study. The device consists of silicon microchannels on whose bottom surfaces multi-walled carbon nanotubes are grown. The objective of the study is to investigate the effec