Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Michael J. Degerstrom"'
Autor:
Barry K. Gilbert, Chad M. Smutzer, Christopher K. White, Clifton R. Haider, Michael J. Degerstrom
Publikováno v:
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
A unique transmission line model for use in high-speed signal simulation was developed. This model, which we term as a “foundational” model, is specified by user-supplied electrical performance parameters, as opposed to the traditional use of phy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40cdfe072d5642d53de60382d5a3764f
https://doi.org/10.1109/isemc.2019.8825252
https://doi.org/10.1109/isemc.2019.8825252
Publikováno v:
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Conductor surface roughness loss models typically use two physical parameters to vary losses. A similar model was developed that required a single parameter so that the model could alternatively be defined to have a specific loss attributed to surfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd15d2489088d20eeaf1597ccb16a805
https://doi.org/10.1109/epeps.2018.8534270
https://doi.org/10.1109/epeps.2018.8534270
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Designing pin-fields and related structures will be challenging for emerging 40 Gb/s electrically-based SerDes links. It is not known whether pin-fields implemented in conventional printed circuit board (PCB) technology will be capable of supporting
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fa916f87d53cb6593b5ef95f6db62a1
https://doi.org/10.1109/ectc.2013.6575755
https://doi.org/10.1109/ectc.2013.6575755
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Traditionally, the large number of high-speed serial links in large, massively-parallel, highly-interconnected computer systems have been analyzed in terms of signal integrity by selecting a small subset of representative links. Co-design decisions o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d59451ca0fe8cfac48fec295b350730
https://doi.org/10.1109/ectc.2011.5898510
https://doi.org/10.1109/ectc.2011.5898510
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
The demands for higher serializer-deserializer (SerDes) data rates dictate the need for more accurate channel models. Assuming that component models are supplied by the vendor, then the printed wiring board (PWB) pin fields are frequently by far the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a80f59c363cb33caf50ea7507722d80e
https://doi.org/10.1109/ectc.2011.5898558
https://doi.org/10.1109/ectc.2011.5898558
Publikováno v:
2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
Existing time-based and frequency-based RLCG extraction methods from measurements on uniform transmission lines are discussed. Using a THRU bisect de-embedding technique proved useful in removing resonances, particularly with the distributed resistan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f4eb6a05a5a53397bc4f4dbea2a2114
https://doi.org/10.1109/epep.2008.4675881
https://doi.org/10.1109/epep.2008.4675881
Autor:
Michael J. Degerstrom, E.S. Daniel, Barry K. Gilbert, Benjamin Buhrow, Patrick Joseph Zabinski, Bart O. McCoy
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Weave-induced skew on printed wiring boards (PWB) for 10+ Gbps SerDes data rates can be very significant. In this paper, we not only investigate weave-induced skew but also look at other sources of skew. We show the weave skew results taken from meas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4b496be4992a580fa269c938837820b
https://doi.org/10.1109/ectc.2008.4550021
https://doi.org/10.1109/ectc.2008.4550021
Autor:
KARL E. FRITZ, BARBARA A. RANDALL, GREGG J. FOKKEN, MICHAEL J. DEGERSTROM, MICHAEL J. LORSUNG, JASON F. PRAIRIE, ERIC L. H. AMUNDSEN, SHAUN M. SCHREIBER, BARRY K. GILBERT, DAVID R. GREENBERG, ALVIN JOSEPH
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd838f71c79f7ad54e6eef8d68758ce4
https://doi.org/10.1142/9789812796844_0009
https://doi.org/10.1142/9789812796844_0009
Autor:
Timothy M. Schaefer, B. Gilbert, G.J. Fokken, E. Daniel, Patrick Joseph Zabinski, Michael J. Degerstrom
Publikováno v:
LEOS 2001. 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society (Cat. No.01CH37242).
The minimization of discontinuities in controlled-impedance signal interconnect will be discussed, including novel ideas for extending present packaging fabrication and assembly technology to higher frequency operation.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adbff6296f69da28f4cecb1b940f770b
https://doi.org/10.1109/leos.2001.969088
https://doi.org/10.1109/leos.2001.969088
Conference
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