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pro vyhledávání: '"Michael Iwatake"'
Autor:
Troy L. Graves-Abe, Prakash Periasamy, Michael Iwatake, Joyce C. Liu, Menglu Li, Thuy Tran Quinn, Subramanian S. Iyer
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Through Silicon Vias (TSV) is a key enabler for interposer and 3Di technologies. As the TSV process integration is maturing, reliability is a key parameter to be studied. One such reliability wear-out mechanisms is electro-migration (EM). In this pap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0dfa820df888868460045aaf6edc7f52
https://doi.org/10.1109/ectc.2016.293
https://doi.org/10.1109/ectc.2016.293
