Výsledky vyhledávání - "Michael Grillberger"

Testing the Mechanical Integrity of On-Chip Interconnects

Autor: Holm Geisler, Martin Brueckner, Petra Hofmann, Matthias U. Lehr, Michael Grillberger, Eckhard Langer

Publikováno v: EDFA Technical Articles. 14:4-12

The introduction of ultralow-k dielectrics is a recent milestone in the quest for higher clock speeds and lower power consumption in ICs. One tradeoff, however, is that interconnect stacks layered with low-k materials rather than SiO2 are more vulner

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::221c2b9ed0320a8ced0816eded2839f0
https://doi.org/10.31399/asm.edfa.2012-2.p004

Zobrazit plný text záznamu

Fracture toughness assessment of patterned Cu-interconnect stacks by dual-cantilever-beam (DCB) technique

Autor: Dmytro Chumakov, Michael Grillberger, M.U. Lehr, F. Lindert, E. Zschech

Dual cantilever beam (DCB) mechanical testing is applied to two kinds of chips, manufactured in the 45 nm technology node. Both chips consist of different numbers of ultra low-k (ULK) dielectric layers, however, they have similarly designed crack-sto

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::06e8d7085c03a0f7b4b4eb3cad75dab2
https://publica.fraunhofer.de/handle/publica/242825

Zobrazit plný text záznamu

Vyhledávací nástroje:

Upřesnit hledání