Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Michael Grillberger"'
Autor:
Holm Geisler, Martin Brueckner, Petra Hofmann, Matthias U. Lehr, Michael Grillberger, Eckhard Langer
Publikováno v:
EDFA Technical Articles. 14:4-12
The introduction of ultralow-k dielectrics is a recent milestone in the quest for higher clock speeds and lower power consumption in ICs. One tradeoff, however, is that interconnect stacks layered with low-k materials rather than SiO2 are more vulner
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::221c2b9ed0320a8ced0816eded2839f0
https://doi.org/10.31399/asm.edfa.2012-2.p004
https://doi.org/10.31399/asm.edfa.2012-2.p004
Dual cantilever beam (DCB) mechanical testing is applied to two kinds of chips, manufactured in the 45 nm technology node. Both chips consist of different numbers of ultra low-k (ULK) dielectric layers, however, they have similarly designed crack-sto
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::06e8d7085c03a0f7b4b4eb3cad75dab2
https://publica.fraunhofer.de/handle/publica/242825
https://publica.fraunhofer.de/handle/publica/242825
Autor:
Geisler, Holm1 holm.geisler@globalfoundries.com, Brueckner, Martin1,2, Hofmann, Petra1, Lehr, Matthias U.1, Grillberger, Michael1, Langer, Eckhard1
Publikováno v:
Electronic Device Failure Analysis. May2012, Vol. 14 Issue 2, p4-12. 7p.
Autor:
Chumakov, Dmytro, Lindert, Frank, Lehr, Matthias U., Grillberger, Michael, Zschech, Ehrenfried
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing; Nov2009, Vol. 22 Issue 4, p592-595, 4p, 2 Black and White Photographs, 2 Charts, 2 Graphs