Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Michael Gribelyuk"'
Autor:
Ho Hoang Huy, Julian Sasaki, Nguyen Huynh Duy Khang, Shota Namba, Pham Nam Hai, Quang Le, Brian York, Cherngye Hwang, Xiaoyong Liu, Michael Gribelyuk, Xiaoyu Xu, Son Le, Michael Ho, Hisashi Takano
Publikováno v:
Applied Physics Letters. 122:052401
It is technically challenging to shrink the size of a tunneling magnetoresistance reader to below 20 nm for magnetic recording technology beyond 4 Tb/in2 due to its complex film stack. Recently, we proposed a reader architecture based on the inverse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3f4ab0897dd45b7f83a32ffd947a1734
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100885313
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100885313
Autor:
Kartik Sondhi, Rahul Sharangpani, Ramy Nashed Bassely Said, Joyeeta Nag, Michael Gribelyuk, Senaka Kanakamedala, Raghuveer S. Makala
Publikováno v:
Journal of Vacuum Science & Technology A. 40:062412
Trends in device miniaturization have driven the adoption of new materials that, in turn, have enabled significant advancements in the field of process engineering and integration for semiconductor technology. Continued progress for device scaling is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae0874089661b29234b62f332fc25d38
https://doi.org/10.1116/6.0002148
https://doi.org/10.1116/6.0002148
Autor:
Michael Gribelyuk, Sandeep Puri, C. Weintraub, Xiaoqiang Zhang, Sheng Xie, Joseph Versaggi, Randy W. Mann, Bianzhu Fu, Hui Zang, Daniel Marienfeld, Ratheesh R. Thankalekshmi
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 25:2449-2457
An essential goal of the static random access memory (SRAM) array termination design is to both terminate as well as maintain a homogeneous environment for the active edge cells in the array. Local layout effects (LLEs) in the array termination desig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb2142d8c923da7e8f29f60ba4cedd2f
https://doi.org/10.1109/tvlsi.2017.2713124
https://doi.org/10.1109/tvlsi.2017.2713124
Publikováno v:
Microscopy and Microanalysis. 24:2188-2189
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14d14843a30760a4c4228588f90298c2
https://doi.org/10.1017/s143192761801142x
https://doi.org/10.1017/s143192761801142x
Autor:
Michael Gribelyuk, Wayne Zhao
Publikováno v:
Microscopy and Microanalysis. 24:1998-1999
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc67fe26413eed178cfaf3e807c93426
https://doi.org/10.1017/s1431927618010474
https://doi.org/10.1017/s1431927618010474
Publikováno v:
Microscopy and Microanalysis. 24:472-473
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b03f07833981196585681a4cb6edad7
https://doi.org/10.1017/s1431927618002854
https://doi.org/10.1017/s1431927618002854
Publikováno v:
Journal of Applied Physics. 126:065702
A method is suggested to prepare lamella for quantitative electron holography by focused ion beam without the need for postprocessing. It relies on thinning of a lamella from the back side of the Si substrate and removal of the protective layers with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0454e80ec3259052865d26d5e9bf2db2
https://doi.org/10.1063/1.5086797
https://doi.org/10.1063/1.5086797
Publikováno v:
Journal of Applied Physics. 125:165306
A Transmission Electron Microscopy (TEM)-based method is suggested to measure the composition of SiGe in 3-D structures using Electron Energy Loss Spectroscopy (EELS). The method accounts for the presence of films other than SiGe within the TEM lamel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bcd1d1166dfa8e3a268ced844a7dd9b
https://doi.org/10.1063/1.5083952
https://doi.org/10.1063/1.5083952
Autor:
Vu Luong, Obert Wood, Julia Meyer-Ilse, Mohammad Faheem, Patrick A. Kearney, Keith Kwong Hon Wong, Bianzhu Fu, Valentin Parks, Corbin Bennett, Paul van Der Heide, Wayne Zhao, Pawitter Mangat, Michael Gribelyuk, Vicky Philipsen, Esther P.Y. Chen, Yifan Liang, Ajay Kumar
Publikováno v:
Extreme Ultraviolet (EUV) Lithography VII.
Extreme ultraviolet (EUV) lithography with reflective photomasks continues to be a potential patterning technology for high volume manufacturing at the 7 nm technology node and beyond. EUV photomasks with alternative materials to the commonly used Mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2a44b2d2cc3eec3d0a99ce6057b32a1
https://doi.org/10.1117/12.2219215
https://doi.org/10.1117/12.2219215
Autor:
Michael Gribelyuk, Wayne Zhao
Publikováno v:
Microscopy and Microanalysis. 22:1532-1533
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc4e8cd1b0ecaa30a73789c1e1574df8
https://doi.org/10.1017/s1431927616008503
https://doi.org/10.1017/s1431927616008503