Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Michael Goroll"'
Autor:
Michael Goroll, Dominik Udiljak, Reinhard Pufall, Bernhard Wunderle, Georg M. Reuther, Nadine Pflugler
Publikováno v:
Microelectronics Reliability. 99:177-185
Interfacial delamination in semiconductor packages during their lifetime is a reliability risk. For the realisation of a “Design for Reliability” approach, the whole product needs to be studied virtually using Finite Element simulations. Only thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::137143d79759277f0c10e8599291683a
https://doi.org/10.1016/j.microrel.2019.06.001
https://doi.org/10.1016/j.microrel.2019.06.001
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In reliability testing, integrated circuit (IC) packages are subjected to accelerated stress test according to the Joint Electron Device Engineering Council (JEDEC) standards to predict the lifetime under the operating conditions. Accelerated stress
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e32fe5df6acc6585de7dd646513a1a6c
https://doi.org/10.1109/eptc50525.2020.9315088
https://doi.org/10.1109/eptc50525.2020.9315088
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
We explore the capabilities of creep testing for the reliability and robustness assessment of die attach layers within this paper. To this end we conducted finite element simulations and experiments. We optimised our setup in terms of thermal stabili
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a293494ef820535b71e231e6e409e5b
https://doi.org/10.23919/empc44848.2019.8951792
https://doi.org/10.23919/empc44848.2019.8951792
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Different test methods are used within the microelectronics community to quantify adhesion of material combinations interacting inside the package. Button Shear Tests or Bending Tests are popular test methods for studying moulding compound adhesion o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3ade28bb7da54bf965668cce119dc64
https://doi.org/10.1109/eurosime.2019.8724566
https://doi.org/10.1109/eurosime.2019.8724566
Autor:
Georg M. Reuther, Michael Goroll, Reinhard Pufall, Joachim Mahler, Nadine Pflugler, Bernhard Wunderle
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Stress tests are utilised to accelerate failure mechanisms in semiconductor packages during reliability and robustness assessments. One potential failure mechanism is the loss of adhesion at an interface, leading to the failure mode called delaminati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fd6155a5bcd0be26325c6623d61ee6b
https://doi.org/10.1109/estc.2018.8546340
https://doi.org/10.1109/estc.2018.8546340
Autor:
Reinhard Pufall, Rainer Dudek, Georg M. Reuther, Nadine Pflugler, Dominik Udiljak, Michael Goroll
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature changes remain a major concern for the reliability of semiconductor components. Over the last decade a lot of effort was spent to find solution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b7cc8e9d3865931b64a7617ef901196
https://doi.org/10.1109/eurosime.2018.8369942
https://doi.org/10.1109/eurosime.2018.8369942
Autor:
Dominik Udiljak, Bernhard Wunderle, Nadine Pflugler, Michael Goroll, Reinhard Pufall, Georg M. Reuther
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Interfacial delamination in semiconductor packages during their lifetime is a reliability risk. For the realisation of a “Design for Reliability” approach, the whole product needs to be studied virtually using Finite Element (FE) simulations. Onl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e792721f1812ffe28ac6be7c5762d808
https://doi.org/10.1109/eurosime.2018.8369940
https://doi.org/10.1109/eurosime.2018.8369940
Publikováno v:
Microelectronics Reliability. 54:2118-2122
We demonstrate the feasibility of in-situ acoustic detection of micro-cracks in small electronic devices. Applying precisely controlled damage to test vehicles using a nanoindenter, we record brittle fracture of thin layers by means of an ultra-sound
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efccbf8cc613d2817f282c5d1809798e
https://doi.org/10.1016/j.microrel.2014.07.129
https://doi.org/10.1016/j.microrel.2014.07.129
Autor:
Michael Goroll, Reinhard Pufall
Publikováno v:
EDFA Technical Articles. 15:22-25
This article describes two accelerated reliability tests that can help shorten product development cycles for power semiconductor packages. One test simulates the effects of temperature cycling by applying a series of thermal shocks to the test sampl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbbe49bf8efb9bdf3092e6bed4389c3d
https://doi.org/10.31399/asm.edfa.2013-4.p022
https://doi.org/10.31399/asm.edfa.2013-4.p022
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
In order to facilitate the evaluation the quality of layer compositions in terms of reliability, a new, non-destructive test method will be proposed in this paper. The new test method combines finite element simulations with creep testing. The advant
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09ca07c03e8081fd35fc3a3252f827ac
https://doi.org/10.1109/estc.2016.7764506
https://doi.org/10.1109/estc.2016.7764506