Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Michael E. Elta"'
Autor:
Hossein Etemad, B.A. Rashap, Demosthenis Teneketzis, J.P. Fournier, James S. Freudenberg, Jessy W. Grizzle, Stéphane Lafortune, Pramod P. Khargonekar, Fred L. Terry, Pierre T. Kabamba, Martin D. Giles, James Moyne, Michael E. Elta
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 8:286-297
This paper describes the development of real-time control technology for the improvement of manufacturing characteristics of reactive ion etchers. A general control strategy is presented. The principal ideas are to sense key plasma parameters, develo
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 13:1930-1934
Spatially resolved optical imaging experiments were performed in a parallel plate reactor known as the Gaseous Electronics Conference Reference Cell. They consisted of recording the optical emission discharges at various pressures and powers for 1024
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 13:1792-1796
Reactive ion etching is an important process in the fabrication of microelectronic devices. This article reports on work in progress towards developing a strategy for controlling sidewall profile during this process. In this strategy, a response surf
Publikováno v:
AIChE Journal. 41:658-665
The reactive ion etching kinetics of InP studied uses BCl3/Ar and BCl3/Ar/O2 as etchants. High-temperature etching using BCl3 and Ar increases the etch rate negligibly. However, the addition of 30% oxygen in the gas feed increases etch rates by a fac
Autor:
Mark J. Kushner, M. E. Riley, R. J. Van Brunt, J. B. Gerardo, G. Selwyn, Michael E. Elta, P. A. Miller, P. Bletzinger, D. B. Graves, James R. Whetstone, J. R. Torczynski, M. P. Splichal, Mark A. Sobolewski, A. Garscadden, J. T. P. Pender, R. A. Gottscho, J R. Roberts, James K. Olthoff, G. A. Hebner, Jeffery W. Butterbaugh, R. Horwath, K. E. Greenberg, P. J. Hargis, T. R. Turner, Mary L. Brake, M. L. Passow, John E. Heidenreich, J. L. Mock, H. M. Anderson, M. Dalvie, A. Lujan, J. T. Verdeyen, Herbert H. Sawin
Publikováno v:
Review of Scientific Instruments. 65:140-154
A “reference cell” for generating radio-frequency (rf) glow discharges in gases at a frequency of 13.56 MHz is described. The reference cell provides an experimental platform for comparing plasma measurements carried out in a common reactor geome
Autor:
Fred L. Terry, E. G. Woelk, G. O. Munns, George I. Haddad, Michael E. Elta, Timothy J. Drummond, Marc E. Sherwin
Publikováno v:
Journal of Crystal Growth. 111:605-608
An electron cyclotron resonance (ECR) plasma system has been designed for the purpose of using an excited beam of gases during CBE growth. The system was designed to use hydrogen, nitrogen and argon. An ECR plasma system has the ability to ignite a l
Autor:
Michael E. Elta, George I. Haddad, Fred L. Terry, Marc E. Sherwin, G. O. Munns, Selden B. Crary, E. G. Woelk
Publikováno v:
Journal of Crystal Growth. 111:594-598
Minimization of the number of experiments needed to fully characterize and optimize the growth of epitaxial material is the first important step in realizing state of the art device structures. While widely used in some fields such as chemical engine
Publikováno v:
IEEE Transactions on Plasma Science. 19:158-162
A self-consistent particle model of an argon RF glow discharge has been developed. Electric field and charged-particle density profiles determined from simulations with the RF glow discharge model are consistent with results obtained from continuum m
Publikováno v:
Journal of The Electrochemical Society. 138:1143-1146
A new etch technique which oscillates between sputter etching and RIE modes of etching was investigated. Extensive studies for GaAs using a BCl 3 /Ar gas system were performed with standard RIE equipment. The time period and sputter duty cycle are tw
Publikováno v:
Journal of Applied Physics. 69:2885-2888
The relative concentration of atomic fluroine was measured in a CF4 rf glow discharge using the actinometric technique. The dependence of fluorine concentration on power, pressure and flow are presented and shown to be dependent upon reactor wall mat