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pro vyhledávání: '"Michael Conrad Battung"'
Autor:
Wendy Lee, Danny Li, David Farkas, Xing Lan, Michael Conrad Battung, Matthew Parlee, Wen-Ben Luo, L. Dang, Raffi Elmadjian, Xianglin Zeng, Kelly Hennig, Chi Cheung, David M. Eaves, Michael E. Barsky, J. Uyeda, Patty Chang-Chien
Publikováno v:
ECS Meeting Abstracts. :1031-1031
Northrop Grumman Aerospace Systems (NGAS) has developed a Wafer Scale Assembly (WSA) process that is compatible with Benzocyclobutene (BCB) processes. BCB is a common dielectric material used to construct multi-metal interconnects. BCB processes enab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7ed1c2995d6ad6d78d7bb55b7af5d985
https://doi.org/10.1149/ma2010-01/18/1031
https://doi.org/10.1149/ma2010-01/18/1031
