Zobrazeno 1 - 10
of 70
pro vyhledávání: '"Michael A. Huff"'
Publikováno v:
Journal of Transportation Safety & Security. :1-19
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d0e3ce25d74b6c4af38a7a83038cbf3
https://doi.org/10.1080/19439962.2023.2201176
https://doi.org/10.1080/19439962.2023.2201176
Publikováno v:
Case Studies on Transport Policy. 9:1026-1034
Ridesharing holds promise as a more efficient and sustainable version of emergent ride-hailing services. However, the adoption of pooled services in which individuals pay a reduced fare to share a portion of their ride-hailing trip with other passeng
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17cb218d1004beebaeefe9408cd06fcb
https://doi.org/10.1016/j.cstp.2021.05.004
https://doi.org/10.1016/j.cstp.2021.05.004
Autor:
Michael A. Huff
Publikováno v:
Process Variations in Microsystems Manufacturing ISBN: 9783030405588
This chapter covers the importance of ensuring quality and reviews methods for performing yield analysis in microsystems manufacturing. Methods for determining device functional and parametric yields are both reviewed. The types of defects that resul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a749d6210a101c4637246330bdeb07db
https://doi.org/10.1007/978-3-030-40560-1_9
https://doi.org/10.1007/978-3-030-40560-1_9
Autor:
Michael A. Huff
Publikováno v:
Process Variations in Microsystems Manufacturing ISBN: 9783030405588
This chapter covers the important topic process integration where a number of individual processing steps (covered in Chaps. 3 and 4) are combined into a process sequence for the implementation of MEMS devices. A general outline of yield improvement
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de3c2f4388eebae4d7afe945c3d18c7a
https://doi.org/10.1007/978-3-030-40560-1_7
https://doi.org/10.1007/978-3-030-40560-1_7
Autor:
Michael A. Huff
Publikováno v:
Process Variations in Microsystems Manufacturing ISBN: 9783030405588
A general overview of the processing steps commonly used in integrated circuit (IC) manufacturing is provided in Chap. 3. How each processing step is performed, the equipment commonly used, and guidance on the expected dimensional variations when per
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a7ea99355447767f580b8215a7a1cf7
https://doi.org/10.1007/978-3-030-40560-1_3
https://doi.org/10.1007/978-3-030-40560-1_3
Autor:
Michael A. Huff
Publikováno v:
Process Variations in Microsystems Manufacturing ISBN: 9783030405588
Microsystems fabrication utilizes a number of metrology techniques during development and manufacturing that are reviewed in Chap. 5. These techniques are used in development after processing steps are performed (reviewed in Chaps. 3 and 4) to find a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3df95410c0357a578bc0aa159e40939e
https://doi.org/10.1007/978-3-030-40560-1_5
https://doi.org/10.1007/978-3-030-40560-1_5
Autor:
Michael A. Huff
Publikováno v:
Process Variations in Microsystems Manufacturing ISBN: 9783030405588
Chapter 2 provides a foundation for future chapters and begins with a review of the transduction mechanisms most commonly used in the implementation of MEMS microsensors and microactuators. Among the transduction effects covered includes piezoresisti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f4f581cf1762db5ed6d8bd8b0b8ecf0
https://doi.org/10.1007/978-3-030-40560-1_2
https://doi.org/10.1007/978-3-030-40560-1_2
Publikováno v:
ECS Journal of Solid State Science and Technology. 7:P55-P59
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be10a1835d82eb32261e367f04ad427d
https://doi.org/10.1149/2.0121802jss
https://doi.org/10.1149/2.0121802jss
Autor:
Michael A. Huff
Publikováno v:
Micromachines, Vol 12, Iss 991, p 991 (2021)
Micromachines
Micromachines
This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro- and nanofabrication has become a very important enabling technology part
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f2ed80ee42e6f66b1922d11ab7a5ff2b
https://doi.org/10.3390/mi12080991
https://doi.org/10.3390/mi12080991
Autor:
Michael Pedersen, Michael A. Huff
Publikováno v:
Journal of Microelectromechanical Systems. 26:448-455
This paper reports research performed on developing and optimizing a process recipe for the plasma etching of deep high-aspect ratio features into fused silica (fused quartz) material using an inductively coupled plasma reactive-ion etch process. As
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f00fa8a5ac65c482904a5185dd026eed
https://doi.org/10.1109/jmems.2017.2661959
https://doi.org/10.1109/jmems.2017.2661959