Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Michael A, Ellsworth"'
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In order to investigate the limitations and the theoretical cooling limit of the heat pipe heatsink technology, a parametric study of high-performance heatsinks under different design and in-service constraints was conducted. Although the fluid dynam
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e27407c885347ba0a968dcf6b323020
https://doi.org/10.1109/itherm.2019.8756503
https://doi.org/10.1109/itherm.2019.8756503
Autor:
Michael J. Ellsworth, Todd E. Takken, Shurong Tian, Howard V. Mahaney, Mark D. Schultz, Paul W. Coteus, Chris Marroquin, Yuan Yao, Anil Yuksel, Kevin M. O'Connell
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
For high-speed computer systems, the high-power devices such as Central Processor Units (CPUs) and Graphics Processing Units (GPUs) generally must be arranged close together to reduce electrical channel routing distances. In such cases water cooling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80cf822acfd60be8aac357e824706411
https://doi.org/10.1109/itherm.2019.8757281
https://doi.org/10.1109/itherm.2019.8757281
Autor:
Michael J. Ellsworth, Levi A. Campbell
Publikováno v:
Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays.
When contemplating processor module cooling, the notion of maximum cooling capability is not simple or straight forward to estimate. There are a multitude of variables and constraints to consider; some more rigid or fixed than others. This paper prop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd6e4a774c78ed9446c2fd52c0aaca71
https://doi.org/10.1115/ipack2015-48324
https://doi.org/10.1115/ipack2015-48324
Autor:
Prabjit Singh, Michael J. Ellsworth
Publikováno v:
Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays.
Computer processor speeds have increased in recent years to the extent that water cooling is becoming an attractive and sometimes a necessary way of cooling the processors and their associated electronics. Water can conduct heat much faster than air,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72cea88ebc4b6d8bdbcb4625cead6c14
https://doi.org/10.1115/ipack2015-48154
https://doi.org/10.1115/ipack2015-48154
Publikováno v:
Journal of the American Veterinary Medical Association. 228:1559-1564
Objective—To compare the efficacy of modified-live virus (MLV) vaccines containing either type 1 bovine viral diarrhea virus (BVDV) or types 1 and 2 BVDV in protecting heifers and their offspring against infection associated with heterologous noncy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::31d1c3a3a0907aee08051b2804ef9b27
https://doi.org/10.2460/javma.228.10.1559
https://doi.org/10.2460/javma.228.10.1559
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 4:568-585
This paper provides a broad review of the cooling technologies for computer products from desktop computers to large servers. For many years cooling technology has played a key role in enabling and facilitating the packaging and performance improveme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63cb97e43306428c373b2a9bf85dcecf
https://doi.org/10.1109/tdmr.2004.840855
https://doi.org/10.1109/tdmr.2004.840855
Publikováno v:
Journal of Thermophysics and Heat Transfer. 18:193-202
The heat flow across a high-powered silicon-die and water-cooled heat-sink assembly is a very important thermal challenge in many microelectronic applications. A single silicon thermal-die/water-cooled experimental facility was fabricated, and a succ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a92bb3fd1c810abda444283b3c6b4536
https://doi.org/10.2514/1.10175
https://doi.org/10.2514/1.10175
Publikováno v:
IBM Journal of Research and Development. 46:753-761
System performance of an IBM RS/6000® workstation was improved by cooling to sub-ambient temperatures the CMOS circuits of a single-chip module (SCM) mounted on a card. However, when refrigeration temperatures are sufficiently low, the temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39787f30be852558d37b2899e39999bb
https://doi.org/10.1147/rd.466.0753
https://doi.org/10.1147/rd.466.0753
Publikováno v:
Journal of Electronic Packaging. 136
In 2011 IBM announced the Power 775 Supercomputing node/system which, for the time, was a significant increase in computing performance and energy efficiency. The system was designed from the start with water cooling in mind. The result: a system wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cd9335f0cf8a8be35f7d8396f077245b
https://doi.org/10.1115/1.4028119
https://doi.org/10.1115/1.4028119
Autor:
Michael J. Ellsworth
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In 2011 IBM announced the Power 775 Supercomputing node/system which, for the time, was a monumental leap forward in computing performance and energy efficiency. The system was designed from the start with water cooling in mind. The result: a system
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caf76779048847a786ce381b449bab9e
https://doi.org/10.1109/itherm.2014.6892351
https://doi.org/10.1109/itherm.2014.6892351