Zobrazeno 1 - 10
of 65
pro vyhledávání: '"Mian Tao"'
Publikováno v:
Journal of Inequalities and Applications, Vol 2019, Iss 1, Pp 1-16 (2019)
Abstract In this paper, we propose a regularized alternating direction method of multipliers (RADMM) for a class of nonconvex optimization problems. The algorithm does not require the regular term to be strictly convex. Firstly, we prove the global c
Externí odkaz:
https://doaj.org/article/999dfd81334042a8b0a255a2df6117cb
Publikováno v:
Scientific Reports, Vol 7, Iss 1, Pp 1-9 (2017)
Abstract The fabrication of high-quality organic-inorganic hybrid halide perovskite layers is the key prerequisite for the realization of high efficient photon energy harvest and electric energy conversion in their related solar cells. In this articl
Externí odkaz:
https://doaj.org/article/2dfbf90f2fcc4befa5d0a542bd1e5889
Publikováno v:
AIMS Mathematics, Vol 9, Iss 9, Pp 24977-24988 (2024)
Let $ A = kQ/I $ be a string algebra. We show that, if for any vertex $ v $ of its bound quiver $ (Q, I) $, there exists at most one arrow (resp. at most two arrows) ending with $ v $ and there exist at most two arrows (resp. at most one arrow) start
Externí odkaz:
https://doaj.org/article/030f95b7adcd404c9e481f759df6d9bc
Akademický článek
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Autor:
Mian-Tao Wu, Su-Yin He, Shu-Lin Chen, Lin-Fang Li, Zheng-Qiang He, Yuan-Ying Zhu, Xia He, Hao Chen
Publikováno v:
BMC Cancer, Vol 19, Iss 1, Pp 1-11 (2019)
Abstract Background Despite recent advances in the treatments of hepatocellular carcinoma (HCC), the prognosis of HCC patients remains controversial. The purpose of this study was to investigate the prognostic performance of pretreatment albumin to C
Externí odkaz:
https://doaj.org/article/48ad942f2bb54142ab6d2cd95f31b1a8
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Jian, Jin-bao, Chao, Mian-tao
Publikováno v:
In Journal of Mathematical Analysis and Applications 2010 362(1):34-45
Publikováno v:
In Applied Mathematics and Computation 2008 205(1):247-262
Autor:
Sze Pei Lim, Cheng-Ta Ko, Henry Yang, Tony Chen, Cao Xi, Eric Kuah, Zhang Li, Hsing-Hui Wu, Jeffery C. C. Lo, Yu-Hua Chen, Chieh-Lin Chang, Jhih-Yuan Pan, Kim Hwee Tan, John H. Lau, Mian Tao, Junfen Lin, Nelson Fan, Ning Cheng Lee, Iris Xu, Penny Lo, Marc Lin, Margie Li, Ming Li, Ricky Lee, Rozalia Beica, Chia-Hung Lin, Curry Lin
Publikováno v:
International Symposium on Microelectronics. 2018:000057-000063
The design, materials, process, and fabrication of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this study. Emphasis is placed on (1) the application of a dry-film epoxy molding compo