Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Merassi, A."'
Autor:
Merassi, Angelo Antonio
Publikováno v:
Journal of Failure Analysis & Prevention; Oct2024, Vol. 24 Issue 5, p2074-2079, 6p
Publikováno v:
In Microelectronics Reliability September 2019 100-101
Publikováno v:
International Symposium for Testing and Failure Analysis.
Analog fault localization for functional failures is usually a very complex task, especially because a deep knowledge of all the functionalities of the device is often required. In addition, when the part is analyzed in application conditions, the in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::112547ca849e164f7badcafe58c9a35f
https://doi.org/10.31399/asm.cp.istfa2022p0378
https://doi.org/10.31399/asm.cp.istfa2022p0378
Publikováno v:
In European Journal of Mechanics / A Solids 2011 30(2):127-136
Autor:
Angelo Merassi, Matteo Medda
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents an alternative approach for analyzing complex scan chain failures in which there are multiple candidates that could be the root cause. It demonstrates the approach on an automotive IC with several failing flip-flops. An analysis o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::110ec5412b2d8f9ee63cac1dc4db8bfe
https://doi.org/10.31399/asm.cp.istfa2021p0334
https://doi.org/10.31399/asm.cp.istfa2021p0334
Autor:
Matteo Medda, Angelo Merassi
Publikováno v:
International Symposium for Testing and Failure Analysis.
The aim of this paper is to present a typical bridge defect case inside digital circuitry, from diagnosis to emission point of view. Specific considerations have allowed to establish the exact point of failure. Keywords— bridge defect, aggressor an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d087971a50263b8eaa4c200224a190a7
https://doi.org/10.31399/asm.cp.istfa2020p0261
https://doi.org/10.31399/asm.cp.istfa2020p0261
Autor:
Angelo Merassi, Giacomo Langfelder, Federico Zaraga, Antonio Francesco Longoni, Aldo Ghisi, Alberto Corigliano
Publikováno v:
European Journal of Mechanics - A/Solids. 30:127-136
To characterize the effective fracture energy G IC of polysilicon wafers at room temperature, an on-chip MEMS test structure has been designed and fabricated. The device can provide fatigue pre-cracking at the notch apex and subsequently impose a mon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad5162e034dcfae78b4f594822d24917
https://doi.org/10.1016/j.euromechsol.2010.09.006
https://doi.org/10.1016/j.euromechsol.2010.09.006
Autor:
Eric Chappel, Conan, C., Mefti, S., Cannehan, F., Lettieri, G. -L, Proennecke, S., Zanotti, L., Ferrera, M., Merassi, A., Oggioni, L., Perletti, M., Sciutti, A.
Publikováno v:
Scopus-Elsevier
Diabetes is a chronic condition that occurs when the pancreas does not produce enough insulin or when the body cannot effectively use the insulin it produces. People having type 1 diabetes require insulin (10% of all diabetics). People with type 2 di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ab275bcc1eb228c4dae3ac87e3b173d6
https://hal.archives-ouvertes.fr/hal-01763107
https://hal.archives-ouvertes.fr/hal-01763107
Autor:
Antonio Francesco Longoni, Giacomo Langfelder, Aldo Ghisi, Alberto Corigliano, Angelo Merassi, Federico Zaraga
Publikováno v:
Microelectronics and reliability (2008).
info:cnr-pdr/source/autori:G. Langfelder, A. Longoni, F. Zaraga, A. Corigliano, A. Ghisi, A. Merassi/titolo:A new on-chip test structure for real time fatigue analysis in polysilicon MEMS/doi:/rivista:Microelectronics and reliability/anno:2008/pagina_da:/pagina_a:/intervallo_pagine:/volume
Microelectronics and reliability 49 (2009): 120–126.
info:cnr-pdr/source/autori:G. Langfelder, A. Longoni, F. Zaraga, A. Corigliano, A. Ghisi, A. Merassi/titolo:A new on-chip test structure for real time fatigue analysis in polysilicon MEMS/doi:/rivista:Microelectronics and reliability/anno:2009/pagina_da:120/pagina_a:126/intervallo_pagine:120–126/volume:49
info:cnr-pdr/source/autori:G. Langfelder, A. Longoni, F. Zaraga, A. Corigliano, A. Ghisi, A. Merassi/titolo:A new on-chip test structure for real time fatigue analysis in polysilicon MEMS/doi:/rivista:Microelectronics and reliability/anno:2008/pagina_da:/pagina_a:/intervallo_pagine:/volume
Microelectronics and reliability 49 (2009): 120–126.
info:cnr-pdr/source/autori:G. Langfelder, A. Longoni, F. Zaraga, A. Corigliano, A. Ghisi, A. Merassi/titolo:A new on-chip test structure for real time fatigue analysis in polysilicon MEMS/doi:/rivista:Microelectronics and reliability/anno:2009/pagina_da:120/pagina_a:126/intervallo_pagine:120–126/volume:49
Fatigue test results on 15 μm thick polysilicon specimens are presented and discussed, both quantitatively and qualitatively. The test structure is a newly designed, electrostatically actuated, MEMS device that allows the execution of on-chip fatigu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8f048e62c19135e4567f27c7e85332ff
http://hdl.handle.net/11311/545084
http://hdl.handle.net/11311/545084
Autor:
D. Ausilio, Angelo Merassi, Fabio Pasolini, G. Sironi, P. Galletta, Tommaso Ungaretti, A. Mancaniello, Sarah Zerbini, Ernesto Lasalandra, F. Speroni, Michele Tronconi, Benedetto Vigna, Enrico Chiesa, G. Frezza, Barbara Grieco, Massimo Garavaglia, F. Banfi
Publikováno v:
Advanced Microsystems for Automotive Applications 2004 ISBN: 9783540205869
A 30 µg/sqrt(Hz) resolution MEMS based low-g 3-axis accelerometers targeted for emerging automotive application is presented. The device is composed by 2-dice in a single package: the sensing element and the processing IC. The sensing element is rea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd6c160cc7c05a63507e7307d65425b5
https://doi.org/10.1007/978-3-540-76989-7_15
https://doi.org/10.1007/978-3-540-76989-7_15