Zobrazeno 1 - 10
of 789
pro vyhledávání: '"Memory rank"'
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Autor:
Yan, Longhao1 (AUTHOR), Wu, Qingyu2 (AUTHOR), Li, Xi2 (AUTHOR), Xie, Chenchen2 (AUTHOR), Zhou, Xilin2 (AUTHOR), Li, Yuqi1 (AUTHOR), Shi, Daijing1 (AUTHOR), Yu, Lianfeng1 (AUTHOR), Zhang, Teng1 (AUTHOR), Tao, Yaoyu1,3 (AUTHOR), Yan, Bonan1,3 (AUTHOR), Zhong, Min4 (AUTHOR), Song, Zhitang2 (AUTHOR) ztsong@mail.sim.ac.cn, Yang, Yuchao1,3,5,6 (AUTHOR) yuchaoyang@pku.edu.cn, Huang, Ru1,3 (AUTHOR) ruhuang@pku.edu.cn
Publikováno v:
Advanced Functional Materials. 4/21/2024, Vol. 34 Issue 15, p1-10. 10p.
Akademický článek
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Publikováno v:
ACM Transactions on Architecture and Code Optimization. 9:1-28
VLSI process technology scaling has enabled dramatic improvements in the capacity and peak bandwidth of DRAM devices. However, current standard DDR x DIMM memory interfaces are not well tailored to achieve high energy efficiency and performance in mo
Autor:
Yan, Longhao, Wu, Qingyu, Li, Xi, Xie, Chenchen, Zhou, Xilin, Li, Yuqi, Shi, Daijing, Yu, Lianfeng, Zhang, Teng, Tao, Yaoyu, Yan, Bonan, Zhong, Min, Song, Zhitang, Yang, Yuchao, Huang, Ru
Publikováno v:
Advanced Functional Materials; 4/21/2024, Vol. 34 Issue 15, p1-1, 1p
Autor:
Nagi Mekhiel
Publikováno v:
IEEE Access, Vol 4, Pp 1073-1085 (2016)
The increase in processor speed achieved by continuous improvements in technology is causing major obstacles to the parallel processors implemented inside the chip. The time spent in servicing all the cache misses from all processors from a slow shar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9707809215befd5c7926517fcf57f4d1
https://doi.org/10.32920/21463020
https://doi.org/10.32920/21463020
Autor:
Wooyoung Jang
Publikováno v:
IEEE Transactions on Circuits and Systems for Video Technology. 28:3527-3538
The state-of-the-art mobile image and graphic applications demand not only a lot of computing power, but also high-quality memory services. Moreover, depending on the screen orientations of mobile systems, image and graphic data can be accessed in a
Publikováno v:
IEEE Transactions on Computers. 67:32-44
For future exascale computing systems, ultra-high-density memories would be required that consume low power to process massive data. Of the various memory devices, 3D-stacked DRAMs using TSVs are a perfect solution for this purposes. In addition to p
Autor:
Stefan Dietrich, Marcos Alvarez Gonzalez, Milena Ivanov, Mani Balakrishnan, Michael Richter, Filippo Vitale, Jorg Weller, Wolfgang Spirkl, Ralf Oliver Seitter, Sven Piatkowski, Jens Polney, Peter Pfefferl, Cristian Chetreanu, Manfred Plan, Marc Walter, Daniel Lauber, Eugen Huber, Stephan Rau, Swetha Padaraju, Thomas Hein, Maksim Kuzmenka, Martin Broschwitz, Jan Pottgiesser, Martin Brox, Ronny Schneider, Fabien Funfrock, Christian N. Mohr, Juan Ocon Garrido
Publikováno v:
IEEE Journal of Solid-State Circuits. 53:134-143
The graphic DRAM interface standard GDDR5X is developed as an evolutionary extension to the widely available GDDR5. The implementation presented here achieves a data rate of 12 Gb/s/pin on a single-ended signaling interface with 32 IOs for a total me