Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Memory electronic packages"'
Publikováno v:
Memories - Materials, Devices, Circuits and Systems, Vol 3, Iss , Pp 100018- (2022)
In mobile market, the demand of memory packaging increase year over year. While the form factor of memory packages moves toward smaller and thinner geometry with higher pin counts, the package overall mechanical robustness becomes one of a key criter
Externí odkaz:
https://doaj.org/article/b32e7b09622248b5b05f948bf42b66d2
