Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Memon MH"'
Autor:
Yu H; iGaN Laboratory, School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, 230026, China., Wang R; iGaN Laboratory, School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, 230026, China., Memon MH; iGaN Laboratory, School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, 230026, China., Luo Y; iGaN Laboratory, School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, 230026, China., Xiao S; iGaN Laboratory, School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, 230026, China., Fu L; Research School of Physics, The Australian National University, Canberra, ACT, 2600, Australia., Sun H; iGaN Laboratory, School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, 230026, China.; Key Laboratory of Wireless-Optical Communications Chinese Academy of Sciences, Hefei, 230027, China.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Mar; Vol. 20 (10), pp. e2307458. Date of Electronic Publication: 2023 Dec 25.
Autor:
Chen W; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Wang D; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, 48109, USA., Wang W; Hefei National Laboratory for Physical Science at the Microscale, Department of Chemical Physics, University of Science and Technology of China, Hefei, 230027, P. R. China., Kang Y; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Liu X; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Fang S; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Li L; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Luo Y; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Liang K; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Liu Y; National Synchrotron Radiation Laboratory, University of Science and Technology of China, Hefei, 230027, P. R. China., Luo D; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Memon MH; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Yu H; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Gu W; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China., Liu Z; Suzhou Institute of Nano-Tech and Nano-Bionics Chinese Academy of Sciences Chinese Academy of Sciences (CAS), Suzhou, 215123, P. R. China., Hu W; Hefei National Laboratory for Physical Science at the Microscale, Department of Chemical Physics, University of Science and Technology of China, Hefei, 230027, P. R. China., Sun H; School of Microelectronics, University of Science and Technology of China, Hefei, 230029, P. R. China.; Key Laboratory of Wireless-Optical Communications, Chinese Academy of Sciences, University of Science and Technology of China, Hefei, 230029, P. R. China.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Jan; Vol. 36 (1), pp. e2307779. Date of Electronic Publication: 2023 Nov 27.
Autor:
Fang S; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Li L; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Wang W; Hefei National Laboratory for Physical Sciences at the Microscale, University of Science and Technology of China, Hefei, 230026, P. R. China., Chen W; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Wang D; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Kang Y; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Liu X; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Jia H; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Luo Y; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Yu H; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Memon MH; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China., Hu W; Hefei National Laboratory for Physical Sciences at the Microscale, University of Science and Technology of China, Hefei, 230026, P. R. China., Ooi BS; Photonics Laboratory, Computer, Electrical, and Mathematical Sciences and Engineering (CEMSE), King Abdullah University of Science and Technology, 21534, Thuwal, Saudi Arabia., He JH; Department of Materials Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, 999077, P. R. China., Sun H; School of Microelectronics, University of Science and Technology of China, Hefei, 230026, P. R. China.; The CAS Key Laboratory of Wireless-Optical Communications, University of Science and Technology of China, 230027, Hefei, P. R. China.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2023 Jul; Vol. 35 (28), pp. e2300911. Date of Electronic Publication: 2023 Apr 20.
Autor:
Kang Y; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Wang D; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Gao Y; Hefei National Laboratory for Physical Science at the Microscale, Department of Chemical Physics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Guo S; Information Materials and Intelligent Sensing Laboratory of Anhui Province, Institutes of Physical Science and Information Technology, Anhui University, Hefei, Anhui 230601, People's Republic of China., Hu K; Information Materials and Intelligent Sensing Laboratory of Anhui Province, Institutes of Physical Science and Information Technology, Anhui University, Hefei, Anhui 230601, People's Republic of China., Liu B; Platform for Characterization and Test, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences (CAS), Suzhou, Jiangsu 215123, People's Republic of China., Fang S; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Memon MH; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Liu X; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Luo Y; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Sun X; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Luo D; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Chen W; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Li L; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Jia H; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Hu W; Hefei National Laboratory for Physical Science at the Microscale, Department of Chemical Physics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China., Liu Z; Platform for Characterization and Test, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences (CAS), Suzhou, Jiangsu 215123, People's Republic of China., Ge B; Information Materials and Intelligent Sensing Laboratory of Anhui Province, Institutes of Physical Science and Information Technology, Anhui University, Hefei, Anhui 230601, People's Republic of China., Sun H; School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, People's Republic of China.; The CAS Key Laboratory of Wireless-Optical Communications, University of Science and Technology of China, Hefei, Anhui 230029, People's Republic of China.
Publikováno v:
ACS nano [ACS Nano] 2023 Feb 28; Vol. 17 (4), pp. 3901-3912. Date of Electronic Publication: 2023 Feb 08.
Autor:
Sun X; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn.; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P. R. China., Wang D; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Memon MH; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Zhu S; State Key Laboratory of Optoelectronic Materials and Technologies, School of Materials, Sun Yat-sen University, Guangzhou 510275, P. R. China., Yu H; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Wang H; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P. R. China., Fang S; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Kang Y; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Liu X; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Luo Y; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Zhang H; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Luo D; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn., Sun H; School of Microelectronics, University of Science and Technology of China, Hefei 230029, P. R. China. haiding@ustc.edu.cn.
Publikováno v:
Nanoscale [Nanoscale] 2022 Nov 24; Vol. 14 (45), pp. 16829-16836. Date of Electronic Publication: 2022 Nov 24.
Autor:
Khan Z; Micro-/Nano-Electronic System Integration Center, University of Science and Technology of China, Hefei 230027, China., Memon MH; Micro-/Nano-Electronic System Integration Center, University of Science and Technology of China, Hefei 230027, China., Rahman SU; College of Electronic and Information Engineering, Nanjing University of Aeronautics & Astronautic, Nanjing 211106, China., Sajjad M; College of Electronic and Information Engineering, Nanjing University of Aeronautics & Astronautic, Nanjing 211106, China., Lin F; Micro-/Nano-Electronic System Integration Center, University of Science and Technology of China, Hefei 230027, China., Sun L; Micro-/Nano-Electronic System Integration Center, University of Science and Technology of China, Hefei 230027, China.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2020 Nov 06; Vol. 20 (21). Date of Electronic Publication: 2020 Nov 06.
Autor:
Haq AU; School of Computer Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China., Li JP; School of Computer Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China., Khan J; School of Computer Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China., Memon MH; School of Computer Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China., Nazir S; Department of Computer Science, University of Swabi, Swabi 23500, Pakistan., Ahmad S; Department of Computer Science, College of Computer Engineering and Sciences, Prince Sattam Bin Abdulaziz University, P.O.Box. 151, Alkharj 11942, Saudi Arabia., Khan GA; School of Information Science and Technology, Southwest Jiaotong University, Chengdu 611731, China., Ali A; Department of Computer Science and Software Technology, University of Swat, Mingora 19130, Pakistan.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2020 May 06; Vol. 20 (9). Date of Electronic Publication: 2020 May 06.