Zobrazeno 1 - 10
of 47
pro vyhledávání: '"Melina Lofrano"'
Autor:
Melina Lofrano
Publikováno v:
Biblioteca Digital de Teses e Dissertações da USPUniversidade de São PauloUSP.
Este trabalho realiza uma investigação sobre técnicas experimentais para a determinação de Funções de Resposta em Freqüência (FRFs) angulares com aplicações em estruturas do tipo viga. Estas FRFs são definidas considerando-se como variáv
Autor:
Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
Publikováno v:
2023 IEEE International Reliability Physics Symposium (IRPS).
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Autor:
Xinyue Chang, Herman Oprins, Melina Lofrano, Bjorn Vermeersch, Ivan Ciofi, Olalla Varela Pedreira, Zsolt Tokei, Ingrid De Wolf
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Autor:
Giovanni Capuz, Melina Lofrano, Carine Gerets, Fabrice Duval, Pieter Bex, Jaber Derakhshandeh, Kris Vanstreels, Alain Phommahaxay, Eric Beyne, Andy Miller
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:12-20
For die-to-wafer (D2W) stacking of high-density interconnects and fine-pitch microbumps, underfill serves to fill the spaces in-between microbumps for protection and reliability. Among the different types of underfill, nonconductive film (NCF) has th
Autor:
Andy Miller, Jaber Derakhshandeh, Melina Lofrano, Pieter Bex, Carine Gerets, Eric Beyne, Kris Vanstreels, Alain Phommahaxay, Fabrice Duval, Giovanni Capuz
Publikováno v:
International Symposium on Microelectronics. 2020:000185-000191
For die to wafer bonding of high-density interconnects and fine pitch microbumps developing and characterizing suitable underfill materials are required. In general, underfill serve to fill the spaces in-between microbumps for protection and reliabil
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
In this paper, we present a modeling study to investigate the self-heating effect on advanced metallization schemes with airgaps using an experimentally calibrated finite element model. We compared N3 technology node with N2 integrated with airgaps.
Autor:
Ehsan Shafahian, Carine Gerets, Eric Beyne, Masataka Maehara, Vladimir Cherman, G. Jamieson, Pieter Bex, Jaber Derakhshandeh, Inge De Preter, Julien Bertheau, Andy Miller, Fumihiro Inoue, T. Webers, Melina Lofrano, Tom Cochet, Lin Hou, Giovanni Capuz, Geert Van der Plas, Gerald Beyer, Douglas Charles La Tulipe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper full integration flow for a low temperature (150°C) and high throughput die to wafer bonding method is introduced for microbumps pitches down to $10 \mu \mathrm{m}$ . The impact of Co plating chemistry, Sn thickness, annealing temperat
Autor:
O. Varela Pedreira, Naoto Horiguchi, A. Lesniewska, Gayle Murdoch, Melina Lofrano, K. Croes, M. H. van der Veen, A. Dangol, Zs. Tokei
Publikováno v:
IRPS
We evaluate the reliability of a semidamascene BEOL scheme with direct metal etched (DME) Ruthenium and 16 nm wide air gaps (AG). First, we show that Ru can be barrierless independent of the type of deposition (ALD, CVD, PVD) using planar capacitor s
Autor:
Melina Lofrano, Ingrid De Wolf, Jaber Derakhshandeh, Pieter Bex, Vladimir Cherman, Ferenc Fodor, Carine Gerets, Eric Beyne, Gerald Beyer, Andy Miller, Kenneth June Rebibis
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
In this paper the stacking process development and the characterizations of multi-die stacks N=16, which contain 15 thinned top dies on a bottom die, are described. A comparison study between sequential and vertical collective bonding, to see the imp