Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Melanie S. Yajima"'
Autor:
Kevin Geary, Kona Keerti S, Song Hyok Jae, Arthur Bekaryan, Igal Bilik, Melanie S. Yajima, Hasan Sharifi
Publikováno v:
2018 IEEE MTT-S International Conference on Microwaves for Intelligent Mobility (ICMIM).
This paper describes optically semi-transparent and flexible microstrip interconnects and patch antennas at millimeter wave frequencies. They are realized on a 5-mil thick transparent PET film by patterning honeycomb shape metal grids using a standar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72bb38492b76741b43b6288b48447ab7
https://doi.org/10.1109/icmim.2018.8443523
https://doi.org/10.1109/icmim.2018.8443523
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000939-000957
Advances in 2.5D and 3D integration technologies are enabling ultra-compact multi-chip modules. In this abstract, we present the design, fabrication, and experimental characterization of RF inductors microfabricated inside deep silicon recesses. Beca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e81a46e3ddaf20a17c8290851c191362
https://doi.org/10.4071/2015dpc-tp44
https://doi.org/10.4071/2015dpc-tp44
Autor:
Melanie S. Yajima, Andrea Corrion, Miroslav Micovic, Herrault Florian G, Alexandros Margomenos, Keisuke Shinohara
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
We present the fabrication and experimental characterization of wafer-level-packaged GaN power HEMTs incorporating embedded copper thermal heat spreader and microfabricated interconnects for GaN-based RF front-ends. The packaging fabrication technolo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5a41d0cbdfa46f03efe18ead0848805
https://doi.org/10.1109/ectc.2015.7159733
https://doi.org/10.1109/ectc.2015.7159733
Autor:
M. Wetzel, Andrea Corrion, Herrault Florian G, D. F. Brown, Melanie S. Yajima, Alexandros Margomenos, C. Butler, Miroslav Micovic, Keisuke Shinohara, R. Bowen, C. McGuire, A. Kurdoghlian, Robert Grabar, Eric M. Prophet, David H. Chow
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
We report a new wafer-level, low-cost, scalable RF front-end packaging approach that enables heterogeneous integration of GaN integrated circuits (IC) with other ICs (Si, SiGe, InP, GaAs etc) and RF passives in a 3D package that includes RF/DC interc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a034e35b4227ddb4302465d32c345010
https://doi.org/10.1109/itherm.2014.6892387
https://doi.org/10.1109/itherm.2014.6892387