Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Meindert Lunenborg"'
Autor:
Roberto Gonella, Tomasz Brozek, Meindert Lunenborg, J.-C. Giraudin, Christopher Hess, B. Martinet, Franck Arnaud, Laurent Garchery, Kelvin Doong, Christian Dutto
Publikováno v:
2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
FDSOI technology has been proposed as an alternative device scaling path which offers benefits of tunable, superior electrostatics transistor while maintaining simplicity of planar integration. New device type and integration elements brought up chal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a72e8b73807c533b30a2107a5789d234
https://doi.org/10.1109/s3s46989.2019.9320727
https://doi.org/10.1109/s3s46989.2019.9320727
Evaluation of Truly Passive Crossbar Memory Arrays on Short Flow Characterization Vehicle Test Chips
Autor:
Christoph Dolainsky, Dennis Ciplickas, Tomasz Brozek, Rakesh Vallishayee, Christopher Hess, Khim Hong Ng, Hendrik Schneider, Meindert Lunenborg, Larg Weiland, Yuan Yu
Publikováno v:
2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS).
More and more non volatile memory bit cell candidates are emerging which can be implemented between two metal layers in the BEOL process. Thus, short flow Characterization Vehicle® (CV®) Test Chips become beneficial for fast yield and endurance lea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5780c8c3dbd4aa82f1c59edf5c890228
https://doi.org/10.1109/icmts.2019.8730984
https://doi.org/10.1109/icmts.2019.8730984
Autor:
Rakesh Vallishayee, Bob Yu, Meindert Lunenborg, Sharad Saxena, Cheng Jianjun, Christoph Dolainsky, Dennis Ciplickas
Publikováno v:
2013 IEEE International Electron Devices Meeting.
New technologies and integration schemes introduced over the last few generations have increased the sensitivity of transistor performance and variation to its layout and environment. This paper describes an infrastructure for efficient statistical c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::051f5ad0767d97a0a85bc8b4f5d507b5
https://doi.org/10.1109/iedm.2013.6724646
https://doi.org/10.1109/iedm.2013.6724646
Publikováno v:
Extended Abstracts of the Second International Workshop on Junction Technology. IWJT. (IEEE Cat.No.01EX541C); 2001, p15-18, 4p
Autor:
Verweij, J.F., Mouthaan, A.J.
Publikováno v:
ESSDERC '93: 23rd European solid State Device Research Conference; 1993, p719-725, 7p
Publikováno v:
28th European Solid-State Device Research Conference; 1998, p248-251, 4p