Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Mei-Chien Lu"'
Autor:
Mei-Chien Lu, 盧美潔
102
Lung cancer is the leading cause of cancer death in males and females worldwide. The non-small cell lung cancer (NSCLC) accounts for at least 85% lung cancer and easily metastasizes to other organs such as brain, liver and bone. Akt, a serin
Lung cancer is the leading cause of cancer death in males and females worldwide. The non-small cell lung cancer (NSCLC) accounts for at least 85% lung cancer and easily metastasizes to other organs such as brain, liver and bone. Akt, a serin
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/c2vcz4
Autor:
Mei-Chien Lu
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e640e5fbf393e2493c7d2aa58dd486ff
https://doi.org/10.1109/itherm54085.2022.9899657
https://doi.org/10.1109/itherm54085.2022.9899657
Autor:
Mei-Chien Lu
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Hybrid bonding has been explored for more than a decade and implemented recently in high volume production at wafer-to-wafer level for image sensor applications to enable high performance chip-stacking architectures with ultra-high-density chip-to-ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0873bf1e829dc15658512e25e72d52b7
https://doi.org/10.1115/ipack2021-73314
https://doi.org/10.1115/ipack2021-73314
Autor:
Mei-Chien Lu
Publikováno v:
Journal of Electronic Packaging. 144
Numerous technology breakthroughs have been made in image sensor development in the past two decades. Image sensors have evolved into a technology platform to support many applications. Their successful implementation in mobile devices has accelerate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6aba3898bfadbbd4d6dd3ac01b1367e
https://doi.org/10.1115/1.4052069
https://doi.org/10.1115/1.4052069
Autor:
Mei-Chien Lu
Publikováno v:
Journal of Electronic Packaging. 142
Silicon carbide wide bandgap power electronics have gained application spaces in hybrid electric vehicle and electrical vehicles. The Department of Energy has set target performance goals for 2025 to promote electric vehicles and hybrid electric vehi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e5a8ece73d8d67a48dec431abd8c73c6
https://doi.org/10.1115/1.4047472
https://doi.org/10.1115/1.4047472
Autor:
Mei-Chien Lu
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Recent advancements in data storage technology have been driven by strong demands in applications in high performance computing, artificial intelligence, enterprise storage, internet of things (IoT), and mobile applications. Flash memory has migrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad506020a33ae9f0b0da394bea0c447a
https://doi.org/10.1109/eptc47984.2019.9026685
https://doi.org/10.1109/eptc47984.2019.9026685
Autor:
Mei-Chien Lu
Publikováno v:
Journal of Electronic Packaging. 141
Thermal interface materials (TIMs) are crucial elements for packaging of power electronics. In particular, development of high-temperature lead-free die-attach TIMs for silicon carbide wide bandgap power electronics is a challenge. Among major option
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07ffb243ac088417df7e98e7a408353e
https://doi.org/10.1115/1.4042984
https://doi.org/10.1115/1.4042984
Autor:
Mei-Chien Lu
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Thermal Interface materials are crucial elements for packaging of power electronics. In particular, development of high temperature lead free die-attach thermal interface materials for silicon carbide wide bandgap power electronics is a challenge. Fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0484444157a6b235020d195d62026d57
https://doi.org/10.1115/ipack2018-8307
https://doi.org/10.1115/ipack2018-8307
Autor:
Mei-Chien Lu
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Fan-out wafer level packaging is one of the fast moving disruptive technology at semiconductor industry since the transition into heterogeneous integration. The enabling technology to support this move is the formation of reconstituted wafer with kno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::235ea17f788e1b84e823bb33dd7ce0f5
https://doi.org/10.1109/itherm.2018.8419507
https://doi.org/10.1109/itherm.2018.8419507
Autor:
Mei-Chien Lu
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thermal interface materials (TIM) are crucial elements for thermal management of electronics. Heat dissipation during semiconductor electronics operations to maintain junction temperature below specification has long been an issue to performance, eff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c4f6de28c860c59570cb090e2f731bd
https://doi.org/10.1109/itherm.2018.8419592
https://doi.org/10.1109/itherm.2018.8419592