Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Mehmet Haybat"'
Autor:
Mehmet Haybat, Thomas Guenther, Romit Kulkarni, Serhat Sahakalkan, Tobias Grözinger, Thilo Rothermel, Sascha Weser, André Zimmermann
Publikováno v:
Applied Mechanics, Vol 2, Iss 4, Pp 976-995 (2021)
Electronic devices and their associated sensors are exposed to increasing mechanical, thermal and chemical stress in modern applications. In many areas of application, the electronics are completely encapsulated with thermosets in a single process st
Externí odkaz:
https://doaj.org/article/57b815f89d3d4b4382596ab357019cd3
Autor:
Thomas Guenther, Lars Diegel, Marcel Roeder, Marc Drexler, Mehmet Haybat, Peter Wappler, Mahdi Soltani, André Zimmermann
Publikováno v:
Applied Sciences, Vol 10, Iss 12, p 4197 (2020)
Thermoset materials offer a multitude of advantageous properties in terms of shrinkage and warpage as well as mechanical, thermal and chemical stability compared to thermoplastic materials. Thanks to these properties, thermosets are commonly used to
Externí odkaz:
https://doaj.org/article/7c3b9f5b919c4a2aad8ee6fa9420d75c
Autor:
Romit Kulkarni, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger, André Zimmermann
Publikováno v:
Journal of Manufacturing and Materials Processing, Vol 3, Iss 1, p 18 (2019)
An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such p
Externí odkaz:
https://doaj.org/article/491536b3f7564705ac47540bd5197a99
Autor:
Jörg Franke, Simon Petillon, Shengxia Shen, Sascha Weser, Wolfgang Eberhardt, André Zimmermann, Mehmet Haybat, Felix Hausler
Publikováno v:
International Symposium on Microelectronics. 2020:000140-000145
Miniaturization efforts and increasing demands regarding reliability of mechatronic systems require new materials and processes for the 3D mechatronic integrated devices (3D-MID) technology. Currently, in the area of 3D-MID mostly thermoplastic mater
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d368d5524605b5797eed71bb79bc23b0
https://doi.org/10.4071/2380-4505-2020.1.000140
https://doi.org/10.4071/2380-4505-2020.1.000140
Autor:
Romit Kulkarni, Thilo Rothermel, Sascha Weser, Serhat Sahakalkan, Tobias Grözinger, Mehmet Haybat, Thomas Guenther, André Zimmermann
Publikováno v:
Applied Mechanics; Volume 2; Issue 4; Pages: 976-995
Applied Mechanics, Vol 2, Iss 57, Pp 976-995 (2021)
Applied Mechanics, Vol 2, Iss 57, Pp 976-995 (2021)
Electronic devices and their associated sensors are exposed to increasing mechanical, thermal and chemical stress in modern applications. In many areas of application, the electronics are completely encapsulated with thermosets in a single process st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8131e2f0ed980e5972fd7bcc73ad96ca
Autor:
Thomas Guenther, Peter Wappler, Tobias Groezinger, Romit Kulkarni, André Zimmermann, Mehmet Haybat, Mahdi Soltani
Publikováno v:
Journal of Manufacturing and Materials Processing, Vol 3, Iss 1, p 18 (2019)
Journal of Manufacturing and Materials Processing
Volume 3
Issue 1
Journal of Manufacturing and Materials Processing
Volume 3
Issue 1
An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f0600e4661ddf93a2f39a72f89507187
https://www.mdpi.com/2504-4494/3/1/18
https://www.mdpi.com/2504-4494/3/1/18