Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Md. Tusher Ahmed"'
Publikováno v:
Journal of Electronic Materials. 50:233-248
Due to the increased complexity and optimization in microprocessor packaging from 2D to 3D packages, the size of solder joints is being reduced significantly. This trend currently leads to an increased amount of current density across flip-chip solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f936e8cb64fe720d05bd7a83db840bee
https://doi.org/10.1007/s11664-020-08514-y
https://doi.org/10.1007/s11664-020-08514-y
Publikováno v:
Proceedings of the 13th International Conference on Mechanical Engineering (ICME2019).
Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b82efd426a97a2ffccb0f5630bec555
https://doi.org/10.1063/5.0039955
https://doi.org/10.1063/5.0039955
Publikováno v:
AIP Conference Proceedings.
In modern electronic packaging industries, plastic ball grid array (PBGA) has been widely used as the microprocessor components. Upon thermal cycling due to the generation of thermal stresses, the PBGA package may undergo fatigue failure in the solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e21cbfdda920cf96d1fb3049268116a7
https://doi.org/10.1063/1.5044301
https://doi.org/10.1063/1.5044301
Publikováno v:
AIP Conference Proceedings.
Energy harvesting technology has the ability to create self-powered electronic systems that do not rely on battery power for their operation. Wind energy can be converted into electricity via a piezoelectric transducer during the air flow over a cyli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe8a791e6f54ac616914d1dd8988e381
https://doi.org/10.1063/1.4984705
https://doi.org/10.1063/1.4984705
Autor:
Motalab, Mohammad Abdul, Ahmed, Md. Tusher, Bappy, Md. Omarsany, Alam, Muhammad Mahbubul, Rahman, Muhammad Ashiqur, Ali, Mohammad
Publikováno v:
AIP Conference Proceedings; 2020, Vol. 2324 Issue 1, p1-10, 10p
Publikováno v:
Journal of Electronic Materials; Jan2021, Vol. 50 Issue 1, p233-248, 16p