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pro vyhledávání: '"McCann, Scott R."'
Autor:
McCann, Scott R.
As the microelectronic industry moves toward stacking of dies to achieve greater performance and smaller footprint, there are several reliability concerns when assembling the stacked dies on current organic substrates. These concerns include excessiv
Externí odkaz:
http://hdl.handle.net/1853/51889
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1938-1944, 7p
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p2189-2193, 5p