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pro vyhledávání: '"McCann, Scott R."'
Autor:
McCann, Scott R.
As the microelectronic industry moves toward stacking of dies to achieve greater performance and smaller footprint, there are several reliability concerns when assembling the stacked dies on current organic substrates. These concerns include excessiv
Externí odkaz:
http://hdl.handle.net/1853/51889
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1938-1944, 7p
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p2189-2193, 5p
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Nov2021, Vol. 11 Issue 11, p1917-1924, 8p
Autor:
McCann, Scott, Singh, Bhupender, Smet, Vanessa, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.
Publikováno v:
IEEE Transactions on Device & Materials Reliability; Dec2016, Vol. 16 Issue 4, p622-630, 9p
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1-37, 37p
Publikováno v:
Journal of Cutaneous Pathology. May2017, Vol. 44 Issue 5, p500-503. 1p.
Autor:
Juan Diego Soler Pulido
En busca de la Antártida, el último lugar de la tierra. Una ventana al cosmos En el extremo sur de nuestro planeta se esconde un territorio que fue desconocido para los humanos durante la mayor parte de su historia: Antártida. Durante siglos, los