Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Mazuir, J."'
Autor:
Le Texier, F., Mazuir, J., Su, M., Castagné, L., Souriau, J.-C., Liotard, J.-L., Saadaoui, M., Inal, K.
Publikováno v:
In Microelectronic Engineering June 2013 106:139-143
Autor:
Pares, G., Bouvier, C., Castagne, L., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Mercier, L., Planchais, A., Simon, G.
Publikováno v:
2013 European Microelectronics Packaging Conference (EMPC); 2013, p1-7, 7p
Autor:
Pares, G, Bouvier, C., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Planchais, A., Simon, G.
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p304-310, 7p
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p747-751, 5p
Autor:
Parès, G., De Crecy, F., Moreau, S., Maurice, C., Borbely, A., Mazuir, J., Chapelon, L. L., Sillon, N.
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2011 4th Quarter, Vol. 8 Issue 4, p129-139, 11p
Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation.
Publikováno v:
Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International; 2011, p1-3, 3p
Autor:
Vignesh, Veeramuthu, Wu, Yuanpeng, Kim, Sung-Un, Oh, Jeong-Kyun, Bagavath, Chandran, Um, Dae-Young, Mi, Zetian, Ra, Yong-Ho
Publikováno v:
Journal of Information Display; Mar2024, Vol. 25 Issue 1, p13-59, 47p
Autor:
Li, Wei, Yu, Daquan
Publikováno v:
Electronics (2079-9292); May2023, Vol. 12 Issue 9, p2073, 15p
Autor:
Shuai Shao1 sshao1@binghamton.edu, Dapeng Liu1 dliu5@binghamton.edu, Yuling Niu1 yniu1@binghamton.edu, O'Donnel, Kathy1,2 kathy.odonnell@analog.com, Sengupta, Dipak2 dipak.sengupta@analog.com, Seungbae Park1 sbpark@binghamton.edu
Publikováno v:
Sensors (14248220). Feb2017, Vol. 17 Issue 2, p322. 16p.
Autor:
Yin, Na, Zhao, Yuzhen, Liu, Changhua, Yang, Yue, Wang, Zhi‐Hao, Yu, Wenyan, Zhang, Kaixiang, Zhang, Zhenzhong, Liu, Junjie, Zhang, Yun, Shi, Jinjin
Publikováno v:
Advanced Materials; Jul2022, Vol. 34 Issue 27, p1-16, 16p