Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Maxim Serebreni"'
Autor:
Maxim Serebreni
Publikováno v:
Lead-free Soldering Process Development and Reliability
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9faee79e94017ff27455f2cc1a259c2
https://doi.org/10.1002/9781119482093.ch11
https://doi.org/10.1002/9781119482093.ch11
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2018:000007-000014
Protecting electronic components at harsh environments and applications often requires the use of conformal coatings, underfills or potting compounds. The temperature dependent properties of these materials greatly depend on their chemical formulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e74de9e20d345ee9839f3a5ab998cf1f
https://doi.org/10.4071/2380-4491-2018-hiten-000007
https://doi.org/10.4071/2380-4491-2018-hiten-000007
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Performing board level reliability (BLR) testing is an industry-standard practice to validate the robustness of semiconductor packaging and provides guidance to the user as to the thermomechanical fatigue lifetime in the field. However, the occurrenc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a95abcc7375996dcbab335bcb18362c
https://doi.org/10.1109/ectc.2019.00-32
https://doi.org/10.1109/ectc.2019.00-32
Publikováno v:
SAE Technical Paper Series.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::260c1734fa49c637d8dd44ab40315a57
https://doi.org/10.4271/2019-01-1251
https://doi.org/10.4271/2019-01-1251
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
With the larger size of Ball Grid Array (BGA) solder joints, the available volume for underfilling is significantly increased. Although the size of the solder joints and package dimension governs the volume of underfill material, the larger 2nd level
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::503cec26ae1a960959a4bf03752a9dba
https://doi.org/10.1115/ipack2018-8338
https://doi.org/10.1115/ipack2018-8338
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The increasing thermal demands in power electronic systems require the application of high temperature die attach materials. Transient Liquid Phase Sintered (TLPS) paste-based solder alloys have been demonstrated to effectively manage the thermal and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bfdafa440f82331e6d06cbddb7a411ab
https://doi.org/10.1115/ipack2018-8392
https://doi.org/10.1115/ipack2018-8392
Publikováno v:
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Electronic components, such as ball grid array (BGA), chip scale packages (CSP) and bottom terminated components (BTC) used in harsh use environments often require the use of conformal coatings to meet reliability requirements. In certain coating app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81e60325b97d81573b97e1ebdd59f063
https://doi.org/10.1109/semi-therm.2017.7896906
https://doi.org/10.1109/semi-therm.2017.7896906