Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Maureen A. Hanratty"'
Publikováno v:
IBM Journal of Research and Development. 41:105-118
As the limitations of conventional optical lithography approach, potential extensions of a current technology are examined more closely. One of these extensions is to limit the photoresist thickness that is needed for recording the imaging informatio
Publikováno v:
Journal of Photopolymer Science and Technology. 8:689-696
Process control in photolithography will be a key requirement for the successful manufacturing of 0.25 micron semiconductor products. A program to study photolithography process control techniques was recently undertaken at Texas Instruments. The tar
Autor:
Sean C. O'Brien, D.D. White, Jimmy W. Hosch, Gregory B. Shinn, G.G. Barna, K. J. Brankner, Kelly J. Taylor, Roger A. Robbins, A. Lane, Maureen A. Hanratty, L.M. Loewenstein
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 7:149-158
This paper describes the equipment and processes utilized in the Microelectronics Manufacturing Science and Technology (MMST) program. The processes were carried out in a combination of testbeds (AVP, the TI designed and built Advanced Vacuum Process
Publikováno v:
Applied optics. 29(21)
Atomic oxygen has been detected using the four-wave mixing technique of third harmonic generation (THG). Ground state O((3)P(j)) atoms, generated using a microwave discharge, were monitored by focusing a 391-nm dye laser beam into the post-discharge
Autor:
T. Breedijk, D. Rogers, Maureen A. Hanratty, P. Mei, Ih-Chin Chen, Iqbal Ali, Jorge A. Kittl, Amitava Chatterjee, P. Nicollian, S. Murtaza, A. Amerasekera, Somnath S. Nag
Publikováno v:
Proceedings of Technical Papers. International Symposium on VLSI Technology, Systems, and Applications.
Publikováno v:
SPIE Proceedings.
This paper presents a methodology for modeling the space printability at the gate level in 193nm lithography. Spaces are shown to be more susceptible to process variations and lens aberrations than lines are. Experimental Scanning Electron Microscopy
Autor:
Eden Zielinski, Wei W. Lee, Maureen A. Hanratty, Qizhi He, Abha Singh, Guoqiang Xing, D. Rogers
Publikováno v:
SPIE Proceedings.
Antireflective coatings (ARCs) have been used to enhance IC lithography for years, however, many conventional bottom ARCs can no longer maintain acceptable linewidth control, cannot meet stringent deep-UV (DUV) photoresist processing requirements, an
Publikováno v:
SPIE Proceedings.
We have investigated the use of annular illumination on a KrF excimer laser stepper ((lambda) equals 248 nm) working near the resolution limit of the lens. The numerical aperture of the lens was 0.48 and the illuminator-lens combination produced a pa
Autor:
Maureen A. Hanratty, Michael C. Tipton
Publikováno v:
SPIE Proceedings.
Deep UV lithography is an enabling technology for the fabrication of 64 megabit DRAM class devices. Wafer steppers operating at 248 nm currently provide both the resolution and the overlay capability to meet the stringent reguirements imposed by next
Publikováno v:
SPIE Proceedings.
The diffusion enhanced silylated resist or DESIRER process is a well known surface imaging lithographic technique consisting of three steps: exposure, silylation, and dry develop. The success of this method for patterning submicron features depends c