Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Maud Samson"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:2004-2017
A numerical model is presented for the portion of the flip-chip joining process where liquid-state solder bumps on the substrate and on the device merge (wet) to form full interconnections. An excellent agreement is demonstrated between calculations
Autor:
Xike Zhao, Charles Bureau, Maud Samson, Clement J. Fortin, David Wright, Valerie Oberson, Isabelle Paquin, Jean-Claude Raymond, Michael Barnes
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
There is an ever growing need for a fluxless chipjoin process to alleviate the difficulties associated with fluxcleaning in small gaps and to target fluxless packagingapplications such as required for advanced photonics. Moreover, a fluxless process
Publikováno v:
Volume 10: Micro- and Nano-Systems Engineering and Packaging.
A numerical model is developed for the flip chip reflow process, including many significant aspects of the joining dynamics: thermal expansion of the device and substrate; temperature-dependent substrate warpage; random variations of the solder volum