Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Matthieu Nongaillard"'
Autor:
Vincent Georgel, Sophie Ledain, Karine Danilo, Matthieu Nongaillard, Christian Gautier, Sébastien Jacqueline
Publikováno v:
Microelectronics Reliability. 48:1258-1262
Because of its large dimension and its high level of integration, the PICS (Passive Integration Connecting Substrate) developed by NXP prone to top to bottom metal short (TBMS) failure during temperature cycling test. Several options of process modif
Autor:
Matthieu Nongaillard
Publikováno v:
Conversion de l'énergie électrique.
Les composants passifs sont omnipresents en electronique, que ce soit dans les applications les plus simples ou dans les plus complexes. Le besoin de miniaturisation se fait grandement sentir, notamment pour des composants de fortes valeurs. Cependan
Autor:
Jacquinot, Helene, Denis, David
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1372-1378, 7p
Publikováno v:
IEEE Transactions on Device & Materials Reliability; Sep2010, Vol. 10 Issue 3, p396-402, 7p
Part of a two-volume set, this book constitutes the refereed proceedings of the Third Iberian Conference on Pattern Recognition and Image Analysis, IbPRIA 2007, held in Girona, Spain in June 2007. It covers pattern recognition, human language technol