Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Matthias Uhlig"'
Autor:
Christian Wenzel, Johann W. Bartha, D. Zeidler, Thomas Gessner, Stefan E. Schulz, Andreas Bertz, J.-W. Erben, Matthias Uhlig
Publikováno v:
Microelectronic Engineering. 70:314-319
The integration of ultra low k materials in copper damascene architecture is one of the main issues in finding microelectronic-process-compatible dielectric materials. The aim of this paper is to show the integration conformity with common equipment
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb7a36ab1b1e66719cef2d2e10d159e6
https://doi.org/10.1016/s0167-9317(03)00415-5
https://doi.org/10.1016/s0167-9317(03)00415-5
Autor:
Matthias Uhlig, Jef Poortmans, Jean-Francois de Marneffe, Eddy Kunnen, Werner Boullart, B. Rau, Kaidong Xu, Boon Teik Chan
Publikováno v:
Japanese Journal of Applied Physics. 51:10NA01
Surface texturing is an imperative process to reduce the reflection of the incident light on solar cells, by enhancing sunlight diffusion into the silicon solar cells for photon generation. As a result, the current generation can be increased. In thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::445d89629c2bad45659b6fabfc183613
https://doi.org/10.7567/jjap.51.10na01
https://doi.org/10.7567/jjap.51.10na01
Publikováno v:
Journal of Urology. 137
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f474e021f31930edeecbccb38195f8b
https://doi.org/10.1016/s0022-5347(17)75238-x
https://doi.org/10.1016/s0022-5347(17)75238-x