Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Matthias Hutter"'
Autor:
Martin Schneider-Ramelow, Simon Schambeck, Johannes Jaeschke, Matthias Hutter, Andrea Deutinger
The combination of continuous miniaturization of electronics and the demanding reliability requirements for industrial and automotive electronics is one big challenge for emerging packaging technology. One aspect is to increase the understanding of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::40e776c1f954a85dc9cd08a2fb0d4bd9
https://publica.fraunhofer.de/handle/publica/269801
https://publica.fraunhofer.de/handle/publica/269801
Autor:
Arian Grams, Rens Baggen, Christian Tschoban, Marta Martinez-Vazquez, Ivan Ndip, Jacob Reyes, Matthias Hutter, Brian Curran, Klaus-Dieter Lang, Jens Leib, Jan Hofer, Felix Wust
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1231-1240
High-gain steerable antenna arrays in the K-, Ka-, and V-frequency bands have the potential to facilitate high-bandwidth satellite communication for a variety of applications. Copper-core printed circuit boards (PCBs) can offer a cost-effective integ
Autor:
Jördis Rosc, Julien Magnien, Lisa Mitterhuber, Stefan Hörth, Franz Schrank, Lena Goullon, Stefan Defregger, Matthias Hutter, René Hammer, Elke Kraker
Publikováno v:
Microelectronics Reliability. 81:373-380
Reliability testing has become a major focus for light emitting diode (LED) systems to predict its lifetime. One common type of testing methods, which was investigated in this study, is the supply switching test (SST), also called power cycle test. I
Autor:
Franz Schrank, Elke Kraker, Matthias Hutter, Stefan Hörth, Julien Magnien, Lisa Mitterhuber, René Hammer, Stefan Defregger
Publikováno v:
Microelectronics Reliability. 79:462-472
Thermal management in the solid-state lighting sector has become a main issue, due to reliability and efficiency issues. Herein, thermal structure function analysis provides a powerful tool to understand the heat transfer inside operated light emitti
Autor:
Julien Magnien, Lisa Mitterhuber, Jördis Rosc, Stefan Defregger, Stefan Hörth, Elke Kraker, Lena Goullon, Franz Schrank, Matthias Hutter
Publikováno v:
Microelectronics Reliability. :601-605
Flip chip technology has made significant improvements to LED chip on board (COB) packages and modules by reducing thermal resistance compared with traditional wire bonded LEDs. However, one of the critical issues of flip chip packaged LEDs is the re
Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Publikováno v:
Advanced Structured Materials ISBN: 9783030133061
Highly reliable power VCSEL (Vertical Cavity Surface Emitting Lasers) array systems with an optimized optical output require a plan parallel assembly for a homogeneous radiation and an advanced packaging design to ensure good heat dissipation and an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d889e261ae321ee900229f3d617ef64
https://doi.org/10.1007/978-3-030-13307-8_34
https://doi.org/10.1007/978-3-030-13307-8_34
Autor:
Constanze Weber, Matthias Hutter
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Ag sintering as interconnection technology for first level interconnects has made its way to production. For example, in order to join power semiconductors or LEDs. But what about extending the application field to use this technology for large area
Autor:
Matthias Hutter, Constanze Weber, Yann Eichhammer, Marius van Dijk, Charles-Alix Manier, Hermann Oppermann, Kai Zoschke
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
In this work we present the development of a new hermetic wafer level packaging approach for fabrication of white light LEDs with suspended phosphor ceramic converter. In this new architecture, the ceramic converter is not directly attached to the LE
Autor:
Stefan Defregger, Jördis Rosc, Franz Schrank, Julien Magnien, Elke Kraker, Lisa Mitterhuber, Stefan Hörth, Matthias Hutter
In this paper, a parameter driven monitoring model is introduced, in which a flip-chip LED module was investigated during a power cycling test. This approach was investigated to develop a monitoring model to describe thermally induced solder fatigue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6a180703b9387abb859f2f38e3088153
https://publica.fraunhofer.de/handle/publica/256236
https://publica.fraunhofer.de/handle/publica/256236
Autor:
Lena Goullon, Elke Kraker, Franz Schrank, Stefan Hörth, Stefan Defregger, Julien Magnien, Lisa Mitterhuber, Matthias Hutter, Jordis Rose
Publikováno v:
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
The solid lighting industry comply with costumer's requirements of high light output and a higher grade of functionality, especially in the automotive sector. The integration of multiple LED-chips on one illuminant has the advantage of weight and siz