Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Matthew Yao"'
Publikováno v:
Thermal Spray 2021: Proceedings from the International Thermal Spray Conference.
As steam power plants continue to move towards higher operating temperatures in order to improve efficiency, materials exposed to the working fluid are subjected to accelerated degradations in the forms of surface oxidation and reduced mechanical pro
Publikováno v:
Materials at High Temperatures. 37:1-10
The performance of S16, a CoCrWC alloy, was evaluated in superheated steam (SHS) at 625°C and 800°C (at 0.1 MPa), and in supercritical water (SCW) at 625°C and 26 MPa for 500 hours. S16 exp...
Publikováno v:
Procedia CIRP. 45:167-170
Stellite materials are widely used in demanding conditions such as corrosion and high- load wear components. The ability to develop cobalt-chrome based components by means of three-dimensional printing may increase their performance as well as enable
Publikováno v:
Anal. Methods. 6:6116-6119
Thermal desorption (TD) coupled with GC has been widely used for the determination of airborne volatile organic compounds (VOCs) due to its effectiveness in detecting a wide range of compounds. However, although the residual compounds and artifacts o
Publikováno v:
Materials Letters. 82:184-187
This paper presents a study to compare the electrical resistance between a capped CNT/Cu interface and an open-end CNT/Cu interface. It is found that the capped CNT/Cu interface has (1) much weaker interfacial bond strength, due to the lack of dangli
Publikováno v:
Pediatric Exercise Science. 22:421-430
This pilot study compared bone speed of sound (SOS), bone turnover and insulin-like growth factor 1 (IGF-1) between 20 Caucasian, postmenarcheal, adolescent synchronized swimmers (SS) and 20 aged- and maturity-matched nonswimmers (NS). Daily dietary
Publikováno v:
Journal of Electronic Packaging. 133
Reported in this paper is a quantum mechanics study on the electronic structure and contact resistance at the interfaces formed when an open-end single-walled carbon nanotube (CNT) is in end-contact with aluminum (Al) and palladium (Pd), respectively
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Molecular dynamics simulations are used to compute the thermal conductance at the interface between an open-end single-wall carbon nanotube and a Si substrate for different CNT lengths and temperature. It is found that the thermal conductance at the
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
The interfacial thermal resistance (ITR) between a carbon nanotube (CNT) and adjoining carbon, silicon, or copper substrate is investigated through non-equilibrium molecular dynamics simulation (NEMD). The theoretical phonon transmission also is calc
Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad
Publikováno v:
ASME 2009 InterPACK Conference, Volume 1.
Due to their unique and superior mechanical and electrical properties, carbon nanotubes (CNTs) are a promising candidate as electrical interconnects in nanoscale electronics. A key element in using CNT as electrical interconnects is the full understa