Výsledky vyhledávání - "Matthew Souter"

Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling

Autor: Michael Topper, T. Fritzsch, Kai Zoschke, Matthew Souter, Oswin Ehrmann, Melvin P. Zussman, Hermann Oppermann, Thorsten Fischer, Toshiaki Itabashi, K-D. Lang

Publikováno v: 2012 IEEE 62nd Electronic Components and Technology Conference.

Temporary wafer bonding for thin wafer processing is one of the key technologies of 3D system integration. In this context we introduce the polyimide material HD3007 which is suitable for temporary bonding of silicon wafers to carrier wafers by using

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8d7c9e70e8c82f91cd91ff3182443770
https://doi.org/10.1109/ectc.2012.6248966

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