Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Matthew Parlee"'
Autor:
Khanh Thai, Dennis W. Scott, Joe Zhou, Kelly Hennig, Peter Nam, Reynold Kagiwada, Randy Sandhu, Bert K. Oyama, Aaron K. Oki, Augusto Gutierrez-Aitken, Wen Phan, Patty Chang-Chien, Ben Poust, Craig Geiger, E. Kaneshiro, Neir Cohen, Daniel Ching, Matthew Parlee
Publikováno v:
2010 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).
Northrop Grumman Aerospace Systems (NGAS) is developing an Advanced Heterogeneous Integration (AHI) process to integrate III-V semiconductor chiplets on CMOS wafers under the Compound Semiconductor Materials on Silicon (COSMOS) DARPA program. The obj
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5336033ee53febd87e75d20d39f92a77
https://doi.org/10.1109/csics.2010.5619667
https://doi.org/10.1109/csics.2010.5619667
Autor:
Craig Geiger, Augusto Gutierrez-Aitken, Joe Zhou, Peter Nam, Dennis W. Scott, Matthew Parlee, B. Oyama, Ben Poust, Wen Phan, Patty Chang-Chien, Kelly Hennig, Reynold Kagiwada, Khanh Thai, Randy Sandhu, Aaron K. Oki
Publikováno v:
2009 IEEE MTT-S International Microwave Symposium Digest.
Northrop Grumman Space Technology (NGST) is developing an Advanced Heterogeneous Integration (AHI) process to integrate III-V semiconductor chiplets on CMOS wafers under the Compound Semiconductor Materials on Silicon (COSMOS) DARPA program. The obje
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b5e465d163a50b2b9eb0abac862dad8
https://doi.org/10.1109/mwsym.2009.5165895
https://doi.org/10.1109/mwsym.2009.5165895
Autor:
Wendy Lee, Danny Li, David Farkas, Xing Lan, Michael Conrad Battung, Matthew Parlee, Wen-Ben Luo, L. Dang, Raffi Elmadjian, Xianglin Zeng, Kelly Hennig, Chi Cheung, David M. Eaves, Michael E. Barsky, J. Uyeda, Patty Chang-Chien
Publikováno v:
ECS Meeting Abstracts. :1031-1031
Northrop Grumman Aerospace Systems (NGAS) has developed a Wafer Scale Assembly (WSA) process that is compatible with Benzocyclobutene (BCB) processes. BCB is a common dielectric material used to construct multi-metal interconnects. BCB processes enab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7ed1c2995d6ad6d78d7bb55b7af5d985
https://doi.org/10.1149/ma2010-01/18/1031
https://doi.org/10.1149/ma2010-01/18/1031