Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Matthew M. Mulholland"'
Autor:
Michael DiBattista, Jordan Furlong, Matthew Levesque, Thomas Harper, Christopher G.L. Ferri, Scott Silverman, Matthew M. Mulholland, Nathan Bakken
Publikováno v:
International Symposium for Testing and Failure Analysis.
Reproducible laser-assisted metal deposition with copper hexafluoroacetylacetonate trimethylvinylsilane Cu(hfac) (TMVS) has been demonstrated on a range of relevant semiconductor insulating material surfaces including silicon dioxide (SiO2), crystall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b770e608671dbea3d96fb26edf182a1
https://doi.org/10.31399/asm.cp.istfa2022p0170
https://doi.org/10.31399/asm.cp.istfa2022p0170
Publikováno v:
International Symposium for Testing and Failure Analysis.
Validation techniques on packaged integrated circuit (IC) samples positively impact time to market (TTM) by saving considerable fabrication modification turnaround time and costs. The validation techniques are typically done by working through the ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83ff21dfeacb81b53f211e01ac6e58f2
https://doi.org/10.31399/asm.cp.istfa2017p0580
https://doi.org/10.31399/asm.cp.istfa2017p0580
Publikováno v:
International Symposium for Testing and Failure Analysis.
Post silicon validation techniques specifically Focused Ion Beam (FIB) circuit editing and Failure Analysis (FA) require sample preparation on Integrated Circuits (IC). Although these preparation techniques are typically done globally across the enca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::367d524a4913041db8aacad7cdaf99d2
https://doi.org/10.31399/asm.cp.istfa2016p0204
https://doi.org/10.31399/asm.cp.istfa2016p0204
Autor:
Scott Silverman, Matthew M. Mulholland
Publikováno v:
International Symposium for Testing and Failure Analysis.
Post silicon validation techniques specifically Focused Ion Beam (FIB) circuit editing and Failure Analysis (FA) require backside sample preparation on Integrated Circuits (IC). Although these preparation techniques are typically done globally across
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48cd3a124e060ecde30dc8175fd11e5c
https://doi.org/10.31399/asm.cp.istfa2015p0274
https://doi.org/10.31399/asm.cp.istfa2015p0274
Autor:
Hien Nguyen, Patrick Girard, Zhenzhou Sun, Aida Todri, Luigi Dilillo, Alberto Bosio, Matthew M. Mulholland
Publikováno v:
International Symposium for Testing and Failure Analysis.
Post silicon validation techniques on Integrated Circuits (IC) specifically FIB circuit editing require backside sample preparation done by local mold compound and silicon machining. Conventional methods such as Computer Numerically Controlled (CNC)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1dd6f549c2845fad17620c284c566ac
https://doi.org/10.31399/asm.cp.istfa2013p0490
https://doi.org/10.31399/asm.cp.istfa2013p0490
Publikováno v:
International Symposium for Testing and Failure Analysis.
Post silicon validation techniques require backside sample preparation by silicon thinning techniques. The conventional fixture to this preparation on large die packages causes silicon to crack. A new “4-point bending” fixture was developed to re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df09cb5f69ab1219676498fd1d31b30b
https://doi.org/10.31399/asm.cp.istfa2011p0424
https://doi.org/10.31399/asm.cp.istfa2011p0424