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Autor:
Matteo Tremolada, Olivier Kermarrec, Mark Andrew Shaw, Xueren Zhang, Fabio Pietro Fiabane, Roberto Curti, Massimo Fere, Livio Gobbato, Carine Besset
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Recent progress made in Silicon Photonics building blocks has paved the way for large scale industrialisation of devices that can be fabricated in existing CMOS fabs, and recently important steps have also been taken on the industrialisation on 12″
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af68c8cb46287a27a29b80c55cda1f75
https://doi.org/10.1109/eptc.2016.7861446
https://doi.org/10.1109/eptc.2016.7861446
