Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Matteo Cocchini"'
Autor:
Katharina Scharff, Xiaomin Duan, Matteo Cocchini, Hung Nguyen, Nicole Selezinski, Dierk Kaller, Hubert Harrer
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::930f59ee757e47c59c8e30fef2bca3b0
https://doi.org/10.1109/epeps53828.2022.9947191
https://doi.org/10.1109/epeps53828.2022.9947191
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f885ec79340d88e266b6a7fa527467f7
https://doi.org/10.1109/epeps53828.2022.9947141
https://doi.org/10.1109/epeps53828.2022.9947141
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30fa4a946d78e891914ea6bb19b8272e
https://doi.org/10.1109/ectc51906.2022.00213
https://doi.org/10.1109/ectc51906.2022.00213
Autor:
Wiren D. Becker, James L. Drewniak, Bruce Archambeault, Siqi Bai, Albert E. Ruehli, Samuel Connor, Matteo Cocchini, Jonghyun Cho, Biyao Zhao
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 62:1266-1277
A physics-based circuit modeling methodology for system-level power integrity (PI) analysis and design is presented herein. The modeling methodology is based on representing the current paths in the power distribution network (PDN) with appropriate c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8185d3a4576187bb47630bf181c8d9be
https://doi.org/10.1109/temc.2019.2927742
https://doi.org/10.1109/temc.2019.2927742
Autor:
Samuel Connor, Albert E. Ruehli, Bruce Archambeault, Stephen Scearce, Matteo Cocchini, Siqi Bai, Jun Fan, Brice Achkir, Biyao Zhao, James L. Drewniak
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 9:80-90
An approach is presented for power integrity analysis on multi-layer printed circuit boards in this paper. Two critical current paths are analyzed. Inductance decomposition is applied to identify the critical parameters that can influence the PDN inp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2875d028a45483b585ea4050bab5e398
https://doi.org/10.1109/memc.2020.9327998
https://doi.org/10.1109/memc.2020.9327998
Autor:
Matteo Cocchini, Jun Fan, Shuang Liang, Biyao Zhao, James L. Drewniak, Albert E. Ruehli, Bruce Archambeault, Brice Achkir, Samuel Connor
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 9:84-94
A modeling methodology to calculate the decoupling capacitor interconnect inductance in a multi-layer PCB is proposed herein. The methodology is based on the resonant cavity model of parallel planes. The self-inductance and mutual inductance are extr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d403459c6cf354afd307fc22a918c613
https://doi.org/10.1109/memc.2020.9241560
https://doi.org/10.1109/memc.2020.9241560
Autor:
Samuel Connor, James L. Drewniak, Dale Becker, Albert E. Ruehli, Matteo Cocchini, Matthew S Doyle, Michael Cracraft, Siqi Bai, Stephen Scearce, Shuang Liang, Biyao Zhao
Publikováno v:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium.
With increasingly stringent requirements for lower voltage supply, and higher density in PCB (Printed Circuit) PDN (Power Distribution Network) design, power integrity has an increasingly important role in PCB design. The PI performance of the PCB de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11ad4b949c275a7d65147fcb4852c564
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559159
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559159
Autor:
Berge Layne A, James L. Drewniak, Matthew S. Doyle, Matteo Cocchini, Wiren D. Becker, Schoneck Kyle, Siqi Bai, Samuel Connor
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A method to model, measure, and characterize a high-transient current in an electrical packaging solution is described herein. These methods help overcome the challenge of generating model to hardware correlation in high current applications. A speci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4956038ad943986832cca434d5f515fe
https://doi.org/10.1109/ectc32696.2021.00212
https://doi.org/10.1109/ectc32696.2021.00212
Publikováno v:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
In this paper, a power distribution network analysis of a system card integrating a circuit model of a voltage regulator, an extracted printed circuit board power distribution, and a packaged ASIC with a circuit model and power specification is prese
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18a83ff370cae8bb59cfea70458414a0
https://doi.org/10.1109/emcsi38923.2020.9191610
https://doi.org/10.1109/emcsi38923.2020.9191610
Minimally Invasive 3D Printed Fixtures for Multi Gb/s Channel Characterization with a Logic Analyzer
Autor:
Michael Cracraft, J. Bjorgaard, Matteo Cocchini, M. Doyle, Khaalid P. J. Mcmillan, Wiren D. Becker
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This paper presents a cost-effective method using 3D printing technology to reduce the parasitic losses when probing a channel with a logic analyzer compared to traditional methods. The method is demonstrated on a 16 Gb/s PCIe Gen4 channel, taking ad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::608a9e9994132d074d22cde0548ee4c9
https://doi.org/10.1109/ectc32862.2020.00154
https://doi.org/10.1109/ectc32862.2020.00154