Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Matt Ring"'
Publikováno v:
2022 IEEE International Reliability Physics Symposium (IRPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::952798220bc64feb8ee4dfa72e4d720d
https://doi.org/10.1109/irps48227.2022.9764476
https://doi.org/10.1109/irps48227.2022.9764476
Autor:
Daniel Beckmeier, Matt Ring
Publikováno v:
2021 IEEE International Integrated Reliability Workshop (IIRW).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ec5b58099c84277295c140213a9c9da
https://doi.org/10.1109/iirw53245.2021.9635620
https://doi.org/10.1109/iirw53245.2021.9635620
Autor:
Christian Fella, Jonas Graetz, Dominik Mueller, Andreas Balles, Jeff Gambino, Frank Altmann, Matt Ring
Publikováno v:
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47bf25d43f410eaa0ded4476fce2025e
https://doi.org/10.1109/ipfa53173.2021.9617279
https://doi.org/10.1109/ipfa53173.2021.9617279
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1993-1999
In a series of articles, we consider the effects of the microstructure and the associated anisotropy of Sn grains on electromigration in lead-free solder bumps. In this article, we carried out experiments to characterize microstructures of tin-based
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::404e0b23243a140a99c41840cca19542
https://doi.org/10.1109/tcpmt.2019.2940566
https://doi.org/10.1109/tcpmt.2019.2940566
Autor:
D. Price, J.P. Gambino, Matt Ring, K. Kimura, R.C. Jerome, Kevin A. Stewart, A. Hasegawa, P. Hulse, K. Noldus
Publikováno v:
IRPS
A very stable resistor is needed for analog integrated circuits employed in harsh automotive environments. Precision SiCr thin-film resistors have been characterized by DC and pulsed I-V measurements, high-temperature operating life, and high tempera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58732e2cb6662e84bd25c230e41f8b76
https://doi.org/10.1109/irps46558.2021.9405169
https://doi.org/10.1109/irps46558.2021.9405169
Publikováno v:
IRPS
Power semiconductors used in automotive applications are exposed to higher temperatures and higher currents than devices used in consumer products. The qualification of these devices includes power-temperature cycling (PTC) stresses on fully integrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d72337af2162a329e8116cf141d33999
https://doi.org/10.1109/irps.2019.8720455
https://doi.org/10.1109/irps.2019.8720455
Publikováno v:
2018 International Integrated Reliability Workshop (IIRW).
Power semiconductors used in automotive applications are exposed to higher temperatures and higher currents than devices used in consumer products. The qualification of these devices includes power-temperature cycling (PTC) stresses on fully integrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92c051a5beda7b531034f2390f126347
https://doi.org/10.1109/iirw.2018.8727079
https://doi.org/10.1109/iirw.2018.8727079
Autor:
Chadwin Young, Matt Ring, Jim Lloyd, Avyaya Jayanthinarasimham, Charles LaRow, Alexander Shluger, Marco A. Villena
Publikováno v:
2017 IEEE International Integrated Reliability Workshop (IIRW).
One of the main challenges of the 2D materials is to solve the compatibility problems with others materials. •The community does not help to solve these problems. It is very common for the groups hide the information.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::556a36b76506e37baed232ff12aba40d
https://doi.org/10.1109/iirw.2017.8361246
https://doi.org/10.1109/iirw.2017.8361246
Autor:
Jeff Siddiqui, Scott K. Pozder, Gaddi Haase, Karsten Beckmann, P. Justison, Tom Kopley, Martin Anselm, Matt Ring
Publikováno v:
2017 IEEE International Integrated Reliability Workshop (IIRW).
Are the fields of fracture mechanics, rheology, etc. good enough to address issues In package reliability? No: JEDEC specs all based on DIP wirebond packages. Are we using results from these fields enough or most effectively? Not addressed. Biggest d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::904e2d75c90333ecfc4c9f8212d1281f
https://doi.org/10.1109/iirw.2017.8361249
https://doi.org/10.1109/iirw.2017.8361249
Autor:
Rui Zhang, Giovanni Verzellesi, Giuseppina Puzzilli, Katja Puschkarsky, Charles LaRow, Alexander Shluger, Yuri Tkachev, Marco A. Villena, Kexin Yang, Elnatan Metaev, Milan Pesic, Jim Lloyd, Matt Ring, Peter Paliwoda, Sheldon Tan, Chadwin Young
Publikováno v:
2017 IEEE International Integrated Reliability Workshop (IIRW).
• The deep collaboration between the experimental and simulation groups is needed. • This collaboration require that: • Experimental groups should previously know what kind of information the simulations could provide and what information the s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eeebcf4b2b572d8082e88ed58cdc082
https://doi.org/10.1109/iirw.2017.8361248
https://doi.org/10.1109/iirw.2017.8361248