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Publikováno v:
2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
The Front Opening Unified Pod (FOUP) is used to protect wafers from the Fab environment when they are not being processed. During Gate stack etch, a process known to be a potential source of etch residuals, wafers are separated in a different FOUP to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::778c75f27425bd1b74b76be503ddce73
https://doi.org/10.1109/asmc51741.2021.9435733
https://doi.org/10.1109/asmc51741.2021.9435733
