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Dry film photo resists and polymers - the low cost option for standard and 3-D wafer level packaging
Autor:
Michael Topper, Toshiaki Itabashi, Werner Liebsch, Klaus-Dieter Lang, Oswin Ehrmann, Karin Hauck, Dion Manessis, Tobias Baumgartner, Mats Ehlin
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Driving packaging cost down is essential to make products cheaper. There are several options to reduce costs: One is to switch from one packaging technology to another (cheaper) one. The other is to cut costs for an existing process step by using che