Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Mathias Plappert"'
Autor:
Herbert Danninger, Herbert Hutter, Carsten Schäffer, Oliver Humbel, Michael Fugger, Mathias Plappert, Mathias Nowottnick
Publikováno v:
Microelectronics Reliability. 54:2487-2493
The thermal stability of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si (1 0 0) was investigated by time of flight secondary ion mass spectrometry (ToF-SIMS) depth profiling, X-ray diffraction (XRD), electron microscopy (SEM a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d7d3475ed6f0682b31216cf54414eb7
https://doi.org/10.1016/j.microrel.2014.04.016
https://doi.org/10.1016/j.microrel.2014.04.016
Publikováno v:
Microelectronics Reliability. 52:1993-1997
The diffusion behavior of Titanium in Al0.5Cu/W18Ti (at.%) metallization stacks on monocrystalline Silicon has been investigated. The metallization system was prepared by in situ sputtering deposition. It is demonstrated that WTi is not stable as a d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4ea87cc6e6b3ddfd52728db86787f09
https://doi.org/10.1016/j.microrel.2012.06.066
https://doi.org/10.1016/j.microrel.2012.06.066
Publikováno v:
Semiconductor Science and Technology. 30:035004
We have performed an analytical study of the effects of oxygen plasma ashing processes in semiconductor device fabrication and its impact on minority carrier lifetime in high voltage semiconductor devices. Our work includes a critical background stud
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73a9ec5ab10f446f032d97353f6af87d
https://doi.org/10.1088/0268-1242/30/3/035004
https://doi.org/10.1088/0268-1242/30/3/035004
Publikováno v:
ACM Transactions on Software Engineering & Methodology; Nov2024, Vol. 33 Issue 8, p1-29, 29p
Publikováno v:
ACM Transactions on Software Engineering & Methodology; Nov2024, Vol. 33 Issue 8, p1-26, 26p
Publikováno v:
ACM Transactions on Software Engineering & Methodology; Nov2024, Vol. 33 Issue 8, p1-30, 30p
Publikováno v:
ACM Transactions on Software Engineering & Methodology; Sep2024, Vol. 33 Issue 7, p1-38, 38p
Autor:
Huang, Qing, Luo, Zhiwen, Xing, Zhenchang, Zeng, Jinshan, Chen, Jieshan, Xu, Xiwei, Chen, Yong
Publikováno v:
ACM Transactions on Software Engineering & Methodology; Sep2024, Vol. 33 Issue 7, p1-29, 29p
Autor:
Jiang, Xue, Dong, Yihong, Wang, Lecheng, Fang, Zheng, Shang, Qiwei, Li, Ge, Jin, Zhi, Jiao, Wenpin
Publikováno v:
ACM Transactions on Software Engineering & Methodology; Sep2024, Vol. 33 Issue 7, p1-30, 30p