Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Mathias Nowottnick"'
Publikováno v:
Materials, Vol 11, Iss 1, p 31 (2017)
Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are
Externí odkaz:
https://doaj.org/article/92557847bb004b98a5fc63eb2c60e003
Autor:
Andrej Novikov, Mathias Nowottnick
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 19
The thermal load on electronic assemblies is constantly increasing. The reasons for this increase are, on the one hand, the integration of power electronic components in an ever smaller space and, thus, an increasing power density and, on the other h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0109f1a626182cf27795d694d6c74a44
https://doi.org/10.4071/001c.57716
https://doi.org/10.4071/001c.57716
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Induction soldering is a widely used process for the interconnection of construction parts. This technology allows a local heating process without putting the whole module into the oven, which minimizes the thermal load and thus improves the reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8d9728e9727c1a846db16f1eda0ede7
https://doi.org/10.23919/empc53418.2021.9584988
https://doi.org/10.23919/empc53418.2021.9584988
Autor:
Jacob Maxa, Mathias Nowottnick
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
An active power cycling test-bed for a power MOSFET is presented in this publication. This setup is used to create temperature dependent load cycles of 24 parallel devices. After a passive calibration step the drain-to-source voltage is used to estim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45ed8d8f49b339374b144cafc1beaacb
https://doi.org/10.23919/empc53418.2021.9584958
https://doi.org/10.23919/empc53418.2021.9584958
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000045-000051
Power electronics is a key technology for the advancement and spreading of electromobility applications and compact power supply devices on the market. The use of new WBG semiconductors (e.g. SiC, GaN) as well as highly integrated silicon-based power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62fd98144802bcf8abc7f31f0273c234
https://doi.org/10.4071/2380-4491.2019.hiten.000045
https://doi.org/10.4071/2380-4491.2019.hiten.000045
Publikováno v:
RSC advances. 10(66)
Within this work, we demonstrate that an easy soldering process in combination with wet chemical coating is suitable to realize a strong and reliable solder interconnection of Al substrates, even at short soldering times5 s in ambient air. The micros
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::7b5c6eaed565482528e837832c5a71f1
https://pubmed.ncbi.nlm.nih.gov/35520830
https://pubmed.ncbi.nlm.nih.gov/35520830
Publikováno v:
Periodica Polytechnica Electrical Engineering and Computer Science. 62:172-180
In this work, methods for the endogenous heating of printed circuit boards (PCBs) by means of inductive losses in built-in susceptors are presented. Two basic types of inductive heating were studied, the heating in the transversal field and the heati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9bb188dce463804990b07d17e0a22d4
https://doi.org/10.3311/ppee.13277
https://doi.org/10.3311/ppee.13277
Autor:
Mathias Nowottnick, Juergen Zipprich, Allen Jose George, Markus Klingler, Marlies Breitenbach
Publikováno v:
Microelectronics Reliability. :762-767
Power electronics (PE) modules for inverter units in hybrid/electric vehicles (H/EV) generate a large amount of heat which needs to be dissipated. This is often done via a liquid cooled metallic baseplate which acts as a heat sink. The interconnect b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1057df276e5c7c7260b8a5f60087a3a
https://doi.org/10.1016/j.microrel.2018.06.049
https://doi.org/10.1016/j.microrel.2018.06.049
Autor:
Mathias Nowottnick, Andrej Novikov
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 15:35-40
New technology based on mixing of standard alloy SnCu in form of solder paste with copper paste was presented. This technology allows the production of solder joints with higher standoff consisting of intermetallic compounds. Such solder joints were
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afafd8fa67938b70f679b5c88cdc0a7d
https://doi.org/10.4071/imaps.529384
https://doi.org/10.4071/imaps.529384
Publikováno v:
Microelectronics Reliability. :455-459
A Sn-Cu-based diffusion soldering process is presented that is capable of producing high temperature resistant joints for small area dies, like MOSFETs as well as for larger IGBTs and even large area baseplate or cooler-contacts. It is shown how the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7493dae1366bfaf828cd43191a996cb9
https://doi.org/10.1016/j.microrel.2017.07.058
https://doi.org/10.1016/j.microrel.2017.07.058