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Autor:
Shimon Levi, Matan Tobayas, Sean Hand, Angela Karvtsov, Thomas Muelders, Ishai Schwarzband, Hans-Jürgen Stock, Jason R. Osborne
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIII.
Optical Proximity Correction (OPC) modeling has evolved throughout the years to address 2D edge placement corrections, driven mainly out of CDSEM measurement results. 3D pattern modeling, and 3D-OPC for resist pattern, is much more complex. 3D inform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e50e2df5dbcdf2ce959a1770ac0209db
https://doi.org/10.1117/12.2514666
https://doi.org/10.1117/12.2514666
